Partner Websites: bga labs (Page 1 of 2)

Beamworks Spark 400

1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_smt_pcb_selective_beamworks_spark400.html

for Engineering Labs Automated Mass Rework, Including BGAs Selective Assembly of Planned (and Unplanned) Missing SMT Components Selective Assembly of SMT Connectors, RF Shields, Through Hole Components, Heat Sensitive Components, Paste in Hole, Optical Componetns and Smart Cards, Moisture Sensitive

1st Place Machinery Inc.

Heated Stage X-ray Option

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-inspection-systems/heated-stage-option

: Research and failure analysis labs will benefit from the ability to accurately and quickly prototype or investigate samples Sites can quickly determine thermal oven profiles along with properties of

ASYMTEK Products | Nordson Electronics Solutions

Best Papers - Award Winners | SMTA International

Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm

., Nokia Bell Labs " Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Attachment Reliability " 2019 3rd Place

Surface Mount Technology Association (SMTA)

EPTAC '05 Data Sheets

| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_7711-21-CIS.pdf

& Operator Certification Hands-On Labs ■ Crimping & Harness Assembly Training TECHNICAL SUPPORT ■ Manufacturing Start-Up ■ Process Evaluation

EPTAC '05 Data Sheets

| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_7711-21-CIT.pdf

& Operator Certification Hands-On Labs ■ Crimping & Harness Assembly Training TECHNICAL SUPPORT ■ Manufacturing Start-Up ■ Process Evaluation

EPTAC '05 Data Sheets

| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_7711-21-CSE.pdf

& Operator Certification Hands-On Labs ■ Crimping & Harness Assembly Training TECHNICAL SUPPORT ■ Manufacturing Start-Up ■ Process Evaluation

The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

, Richard Parker4, Keith Howell5, Joerg Trodler6, Adam Murling7 1Nokia Bell Labs, Murray Hill, NJ, USA 2Rockwell Collins, Iowa, USA 3Heller Industries, Florham Park, NJ, USA 4 iNEMI, Tipton, IN, USA 5Nihon Superior Co., Ltd

Heller 公司

Vacuum Reflow Processing On Solder Joint Voiding

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf

, Richard Parker4, Keith Howell5, Joerg Trodler6, Adam Murling7 1Nokia Bell Labs, Murray Hill, NJ, USA 2Rockwell Collins, Iowa, USA 3Heller Industries, Florham Park, NJ, USA 4 iNEMI, Tipton, IN, USA 5Nihon Superior Co., Ltd

Heller Industries Inc.

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