Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
. Layer Count 50 Max. Working Panel Size 21" x 31" Max. Board Thickness .300" Min. Board Thickness 0.16"(6L) Min. Line/Space • I/L - 2 / 1.5mil (HDI) • O/L - 2 / 1.5 mil (HDI) Warpage .001" / sq. in. BGA Pitch 0.20mm Layer to Layer Registration 3 mil
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/technology-roadmap/
. Layer Count 50 Max. Working Panel Size 21" x 31" Max. Board Thickness .300" Min. Board Thickness 0.16"(6L) Min. Line/Space • I/L - 2 / 1.5mil (HDI) • O/L - 2 / 1.5 mil (HDI) Warpage .001" / sq. in. BGA Pitch 0.20mm Layer to Layer Registration 3 mil
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_3d-step-to-vrml_topic976.xml
. But since you're simply using low quality for mechanical fit, this may or may not be ok as the area inside of a BGA that has no center pins could feasibly be used for part placement
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic976&OB=DESC.html
. That's all the mechanical guys would be interested in. They are going to be checking the PCB has a single thing against the enclosure - they are not bothered about components under the BGA
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic976.html
. That's all the mechanical guys would be interested in. They are going to be checking the PCB has a single thing against the enclosure - they are not bothered about components under the BGA
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/technical-papers
. Board Level Mechanical Drop Tests This study compares high-speed bondtesting with board level drop testing of BGA packages. Battery Battery Testing Datasheet Battery Bondtesting Blind Spot Semiconductor Overcoming Passivation Layer Interference in Ball Shear Testing App Note Bondtesting of Memory Devices Low Profile Zone
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/3d-step-to-vrml_topic976&OB=ASC_page2.html
. That's all the mechanical guys would be interested in. They are going to be checking the PCB has a single thing against the enclosure - they are not bothered about components under the BGA
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/3d-step-to-vrml_topic976_post3706.html
. That's all the mechanical guys would be interested in. They are going to be checking the PCB has a single thing against the enclosure - they are not bothered about components under the BGA
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/3d-step-to-vrml_topic976_post3708.html
. That's all the mechanical guys would be interested in. They are going to be checking the PCB has a single thing against the enclosure - they are not bothered about components under the BGA
