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Login Footprints / Land Patterns Sub Forum(s) Topics Posts Last Post Allegro 18 87 Package Symbols versus Mechanical... By delovetsky 17 Feb 2020 at 7
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. To enable this trend, more manufacturers are using flip chips that have more I/O’s and smaller bumps sizes. This has introduced underfill dispensing that fills the gap between the flip chip and the substrate with polymer epoxy to help reduce thermal and mechanical stress at the bonding interface
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< 1 23 24 25 26 27 34 > Topics / Topic Starter Rating Replies Views Last Post Forum Topics BGA Footprint By gcary , 20 Jan 2019 at 11
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:06am Can't Run Library Expert Lite - Licence Server? By MarcoHess , 03 May 2016 at 12:02am 8 3358 By Nick B 08 Mar 2018 at 12:04pm BGA Pad Size By 5not4 , 27 Feb 2020 at 8
