PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_version-history_forum1.xml
every footprint per the manufacturer’s tape and reel rotation saving time and money in assemblyUpdated the SM, TH and BGA FPX files that come with Library Expert EnterpriseNow contain over 9,000 different manufacturer Case
Blackfox Training Institute, LLC | https://www.blackfox.com/about/instructors/
Español Blackfox Courses Instructor Soldering Series Component Series Mechanical Assembly Series Operator Component Series Customizable Soldering Comprehensive Soldering Printed Circuit Board Repair ESD
Heller Industries Inc. | https://hellerindustries.com/recent-searches/
weld 1707mkv Underfill cure Die attach substrate 1800ecl 1809 mkiii 1808exl Underfill bga 593555 Die attach wire bond Die attach sintering Die attach lead frame 1103d2a3 Curing oven for composites
| https://www.smtfactory.com/Development-Stage-of-SMT-Pick-and-Place-Machine-id47535177.html
. Although the mechanical alignment method used by the pick and place machine at that time determined the pick and place speed was low (1000~2000 pieces/hour), the pick and place
| http://etasmt.com/cc?ID=te_news_industry,24567&url=_print
. lC pin pitch has developed to 0.5mm, 0.4mm, 0.3mm, BGA has been widely used, CSP has also emerged, and shows a rapid upward trend, no-clean, low-residue solder paste on materials has been widely used
| http://etasmt.com:9060/te_news_industry/2021-09-01/24567.chtml
. lC pin pitch has developed to 0.5mm, 0.4mm, 0.3mm, BGA has been widely used, CSP has also emerged, and shows a rapid upward trend, no-clean, low-residue solder paste on materials has been widely used
| http://etasmt.com/te_news_industry/2021-09-01/24567.chtml
. lC pin pitch has developed to 0.5mm, 0.4mm, 0.3mm, BGA has been widely used, CSP has also emerged, and shows a rapid upward trend, no-clean, low-residue solder paste on materials has been widely used
| https://www.smtfactory.com/I-C-T-SMT-Vacuum-Reflow-Oven-Machine-helps-you-to-solve-the-problem-of-High-Solder-Voids-Rates-id45973467.html
. Due to the influence of void factors, the quality reliability of most solder joints are uncertain, resulting in the decrease of mechanical strength of solder joints, which will seriously affect the
KingFei SMT Tech | http://www.smtspare-parts.com/sale-8532845-qp341-smt-machine-fuji-nozzle-3-7m-adbpn-8143-in-pick-and-place-machine.html
=200 ADBPN-8340 QP-3 NOZZLE SINGLE 20Φ L=110 ADBPN-8341 QP-3 NOZZLE SINGLE 23ΦG (for BGA) FUJI QP242 QP132 INDEX SMT NOZZLE Part Number Description ABHPN - 8510 QP-S-12 -Ø
KingFei SMT Tech | https://www.smtspare-parts.com/sale-8532845-qp341-smt-machine-fuji-nozzle-3-7m-adbpn-8143-in-pick-and-place-machine.html
=200 ADBPN-8340 QP-3 NOZZLE SINGLE 20Φ L=110 ADBPN-8341 QP-3 NOZZLE SINGLE 23ΦG (for BGA) FUJI QP242 QP132 INDEX SMT NOZZLE Part Number Description ABHPN - 8510 QP-S-12 -Ø
