| https://www.eptac.com/faqs/ask-helena-leo/ask/problems-with-pcb-micro-voiding
. The true root cause is still under investigation, but a Kirkendall voiding mechanism may play a part. These voids can affect solder joint reliability, particularly in instances when brittle fracture is initiated within the IMC during drop or mechanical hock to the solder joint
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. Jade Plus Nordson DAGE High quality X-ray inspection for production applications. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking
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its chosen markets of Semiconductor and PCBA Manufacture. It has an award winning portfolio of Bondtester and X-ray Inspection Systems for destructive and non-destructive mechanical testing and inspection of electronic components
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| https://www.eptac.com/ask/problems-with-pcb-micro-voiding/
. The true root cause is still under investigation, but a Kirkendall voiding mechanism may play a part. These voids can affect solder joint reliability, particularly in instances when brittle fracture is initiated within the IMC during drop or mechanical hock to the solder joint
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. Please consult factory for further details. Products Content Your results for: Die Shear Test Equipment Packaging Nordson DAGE Nordson DAGE Bondtesters are widely used for precision destructive and non-destructive mechanical and material testing
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Inspection of Flip Chips and BGA's Nordson DAGE Modern 2D / 3D X-ray Inspection - Emphasis on BGA, QFN, 3D Packages and Counterfeit Components Nordson DAGE Brittle Failure Mechanism of SnAgCu and SnPb
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Contact Global HQ Africa Asia Central and South America Europe USA and Canada Industrial & Machinery Nordson DAGE Bondtester and X-ray systems are widely used for precision destructive and non-destructive testing and inspection where electronics and mechanical components are involved
