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. Instead of using Footprint expert batch file, if I manually map the STEP model using Orcad 3D canva, I obtain a subtantialy smaller footprint file, especially for BGA with hundreds of pins
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. Testing the mechanical integrity of these bonds is an important aspect of the manufacturing quality assurance process however testing copper interconnects presents several challenges for traditional shear testing
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=15
. Testing the mechanical integrity of these bonds is an important aspect of the manufacturing quality assurance process however testing copper interconnects presents several challenges for traditional shear testing
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=7
. Testing the mechanical integrity of these bonds is an important aspect of the manufacturing quality assurance process however testing copper interconnects presents several challenges for traditional shear testing
