Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Alan Donaldson and Raiyomand Aspandiar, Intel Corporation "Hot Air Lead-free Rework of BGA Packages & Sockets" 2003: Dave Nelson and Hector Pallavicini, Raytheon Systems Company "Manufacturing and Reliability of Pb-free and Mixed System Assemblies (SnPb/Pb-Free
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Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
LEAD-FREE SMT PROCESSING Chrys Shea and Ranjit S Pandher Abstract 18-1 HOT AIR LEAD-FREE REWORK OF BGA PACKAGES & SOCKETS Alan Donaldson and Raiyo Aspandiar Abstract 18-1 DEVELOPMENT OF 3D-REDISTRIBUTION AND BALLING TECHNOLOGIES FOR FABRICATION OF
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
; this was consistent with work from others [6]. As a result some BGA components on notebook products required partial underfilling (or edge glue
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