35727 bga surface mount results

SolderTip #46: Open Connections Found on BGA Components | EPTAC

| https://www.eptac.com/soldertips/soldertip-46-open-connections-found-on-bga-components/

. It has been seen, over the years, that BGA components do warp and many times creates shorts in the center of the device itself. Based upon the size of the component, when this happens, the edges of the components are rising up off the surface of the PCB

PCB Libraries Forum : Create BGA Footprint With Offset/Staggered Pins

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_create-bga-footprint-with-offset-staggered-pins_topic2422.xml

designer.I was trying to use the "Create new Surface Mount" tool to get an IPC7351 compliant footprint and reasonable STEP model.  It does everything needed except the ability to set any offset for staggered rows/columns

PCB Libraries, Inc.

BGA Rework Training and Certification – Precision PCB Services, Inc.

Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-training

BGA Rework Training and Certification – Precision PCB Services, Inc. Search Log in or Create account Cart : 0 Menu Cart 0 Home Catalog Blog About us Log in Create account Search Precision PCB Services, Inc

Precision PCB Services, Inc

Dispense on Flip Chip & BGA, Bumped Silicone Die: Underfill Dispensing

GPD Global | https://www.gpd-global.com/co_website/pcdpumpseries-underfill.php

& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER

GPD Global

Dispense on Flip Chip & BGA, Bumped Silicone Die: Underfill Dispensing

GPD Global | https://www.gpd-global.com/pcdpumpseries-underfill.php

& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER

GPD Global

Dispense on Flip Chip & BGA, Bumped Silicone Die: Underfill Dispensing

GPD Global | https://www.gpd-global.com/dispense-flip-chip-bga.php

& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER

GPD Global

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

. Aspandiar, “Voids in Solder Joints”, SMTAI Conference Proceedings, 2006. 5. D. Banks et al, “The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability”, Surface Mount International Conference, 1996. 6. IPC Solder Products Value Council, “The

Heller Industries Inc.

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf

. Aspandiar, “Voids in Solder Joints”, SMTAI Conference Proceedings, 2006. 5. D. Banks et al, “The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability”, Surface Mount International Conference, 1996. 6. IPC Solder Products Value Council, “The

Heller Industries Inc.

Create BGA Footprint With Offset/Staggered Pins - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/create-bga-footprint-with-offset-staggered-pins_topic2422_post9952.html

. I was trying to use the "Create new Surface Mount" tool to get an IPC7351 compliant footprint and reasonable STEP model.  It does everything needed except the ability to set any offset for staggered rows/columns

PCB Libraries, Inc.

Create BGA Footprint With Offset/Staggered Pins - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/create-bga-footprint-with-offset-staggered-pins_topic2422.html

. I was trying to use the "Create new Surface Mount" tool to get an IPC7351 compliant footprint and reasonable STEP model.  It does everything needed except the ability to set any offset for staggered rows/columns

PCB Libraries, Inc.