PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/bga-pad-size_topic2607_post11390.html
: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5183 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 27 Feb 2020 at 11:31am The IPC mathematical model uses this table to calculate BGA pad stacks, but the Library Expert Preferences allows the User to change the values to whatever works best for you
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/bga-pad-size_topic2607_post10649.html
: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5484 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 27 Feb 2020 at 11:31am The IPC mathematical model uses this table to calculate BGA pad stacks, but the Library Expert Preferences allows the User to change the values to whatever works best for you
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
processing. Cross sectional views of the voiding are shown in the optical photomicrographs in Figure 9. Many of the voids observed in the cross-sectional analysis exceed the IPC-JSTD-001 BGA maximum void criteria of 30% of the X-ray image area [23]. This
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
processing. Cross sectional views of the voiding are shown in the optical photomicrographs in Figure 9. Many of the voids observed in the cross-sectional analysis exceed the IPC-JSTD-001 BGA maximum void criteria of 30% of the X-ray image area [23]. This
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
processing. Cross sectional views of the voiding are shown in the optical photomicrographs in Figure 9. Many of the voids observed in the cross-sectional analysis exceed the IPC-JSTD-001 BGA maximum void criteria of 30% of the X-ray image area [23]. This
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-inspection-systems/explorer-one
detector allows you to easily navigate samples and identify defects quickly. Easily ensure IPC-A-610 and IPC-7095 compliance with in-built tools for dimension measurement, BGA void analysis, bump diameter and roundness and through hole filling
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-inspection-systems/quadra-5-x-ray-inspection-system
. Inbuilt automated tools for BGA quality analysis, bump diameter and roundness, wire sweep, solder and QFN voiding make quick work of finding defects, helping you achieve IPC-A-610 and IPC-7095 compliance
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
. Low-void IPC-7097A is the Specification for the Design and Assembly Process Implementation for BGAs. The inspection criteria for Ball Grid Array (BGA
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
: Air Temperature:240°C Small Voids Seen but within IPC Spec BGA Cross Section PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 14 of 24 Rev Level: 1 Rev Date: 1/03/01 Test # 6 Material: T, S, C, A Atmosphere
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf
: Air Temperature:240°C Small Voids Seen but within IPC Spec BGA Cross Section PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 14 of 24 Rev Level: 1 Rev Date: 1/03/01 Test # 6 Material: T, S, C, A Atmosphere
IPC is the trade association for the printed wiring board and electronics assembly industries.
Training Provider / Events Organizer / Association / Non-Profit
3000 Lakeside Drive, 309 S
Bannockburn, IL USA
Phone: 847-615-7100
