| https://www.eptac.com/ask/problems-with-pcb-micro-voiding/
.” Here is another reference to these types of voids: http://ecadigitallibrary.com/pdf/56thECTC/s06p7lr.pdf Effect of Intermetallic and Kirkendall Voids Growth on Board Level Drop Reliability for SnAgCu Lead-free BGA Solder Joint Luhua Xu and John H.L
Heller Industries Inc. | https://hellerindustries.com/fluxless-soldering/
. Using flux, however, has its drawbacks: Flux can outgas during the reflow process creating solder voids. Flux leaves behind a residue which needs to be cleaned post reflow
| https://www.eptac.com/soldertip/soldertips-printed-circuit-board-bow-and-twist-showing-up/
: We have recently started to see board flexing in one of our circuit board assemblies. This assembly has a 40mm PoP BGA component on it with an integrated heat sink
Heller Industries Inc. | https://hellerindustries.com/bit_publications/reflow-techniques-for-void-reduction/
? Reflow Soldering Problems Overview Causes & Defects – Reflow Soldering Solder Ball Defects Opensor Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination
| https://www.eptac.com/faqs/soldertips/page/3
. Have a specific question of your own? CLICK HERE SolderTip #46: Open Connections Found on BGA Components General Tip Question: We have been stumped by occasional opens at the corner balls of some BGA components after reflow
Heller Industries Inc. | https://hellerindustries.com/white-papers-technical-articles/
. The Last Will And Testament of the BGA Void. Reflow Techniques for Void Reduction. Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force
Heller Industries Inc. | https://hellerindustries.com/publications/
. The Last Will And Testament of the BGA Void. Reflow Techniques for Void Reduction. Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/hot-bump-pull?con=t&page=10
Voids - Circuits Assembly article Nordson DAGE 4800 Advanced Wafer Level Bondtesing Brochure Nordson DAGE Lead-free_Inspection_Methods Nordson DAGE The Challenges of Package on Package (POP
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate?con=t&page=12
. This is done by screening combinations of solder ball alloys and under bump metallization for various industry standard failure modes by identifying the presence of voids at the UBM interface that
Heller Industries Inc. | https://hellerindustries.com/bit_publications/the-effect-of-vacuum-reflow-processing-on-solder-joint-voiding-and-thermal-fatigue-reliability/
– Reflow Soldering Solder Ball Defects Wicking Defects Opensor Insufficient Solder Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination
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