ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-inspection-systems/heated-stage-option
. The ability to simulate the temperature environment of a thermal oven or that of an external environment makes viewing voids and defects a must for in-depth analysis. Benefits
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-force-pull?con=t&page=16
. Please consult us for further details. Products Content Your results for: High Force Pull XM8000 Brochure Nordson DAGE Jade Plus Brochure v8b web Eng Nordson DAGE Assure Series Brochure EN Nordson DAGE Modern 2D / 3D X-ray Inspection - Emphasis on BGA, QFN, 3D Packages and
Baja Bid | https://bajabid.com/wp-content/uploads/2023/06/XT-V-130-flyer-EN.pdf
. With the XT V 130, you can get the inside view of printed circuit boards, in a smooth, non-destructive process. The Nikon Metrology XT V130 X-ray inspection system is a high-precision, flexible solution that facilitates defect analysis in loaded PCB boards. Designed for 100% BGA and
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
@smta.org Advanced Packaging/Components: 2.5/3D Packaging and Integration BGA/CSP Biomedical Packaging Component Storage Connector Technology Copper Pillars Copper Wire Bonding Diffusion Bonding Embedded and Miniature Passives Environmental
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/imaging-modes
. To search an internal interface for delaminations, a planar view (C-Scan or interface scan) would be recommended. If you desire to view the body of a material for voids, inclusions and other inhomogeneities that are not necessarily located at a known depth, a volumetric view (bulk scan or 3V
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
] Yunus et al., “Effect of voids on the reliability of BGA/CSP solder joints”, 26th IEEE/CPMT IEMTS, San Diego, 2000 [17] Okereke and Ling, “A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder
| https://www.eptac.com/solder-tips/
: We have recently started to see board flexing in one of our circuit board assemblies. This assembly has a 40mm PoP BGA component on it with an integrated heat sink
Heller Industries Inc. | https://hellerindustries.com/recent-searches/
weld 1707mkv Underfill cure Die attach substrate 1800ecl 1809 mkiii 1808exl Underfill bga 593555 Die attach wire bond Die attach sintering Die attach lead frame 1103d2a3 Curing oven for composites
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/electronics-assembly-and-packaging?con=t&page=6
5 X-ray Inspection system in action Investigating Voids - Circuits Assembly article Nordson DAGE Quadra™ 3 Nordson DAGE High quality X-ray inspection for production applications
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/ball-shear-solder-ball-shear?con=t&page=9
. Products Content Your results for: Ball Shear/Solder Ball Shear Prospector Brochure_2019 Nordson DAGE Investigating Voids - Circuits Assembly article Nordson DAGE Computerized Tomography Datasheet Nordson DAGE Gensys DataSheet Nordson
