PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/bga-pad-size_topic2607_post10645.html
: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5184 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 27 Feb 2020 at 11:31am The IPC mathematical model uses this table to calculate BGA pad stacks, but the Library Expert Preferences allows the User to change the values to whatever works best for you
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/bga-pad-size_topic2607_post12477.html
: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5193 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 27 Feb 2020 at 11:31am The IPC mathematical model uses this table to calculate BGA pad stacks, but the Library Expert Preferences allows the User to change the values to whatever works best for you
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/bga-pad-size_topic2607_post11390.html
: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5183 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 27 Feb 2020 at 11:31am The IPC mathematical model uses this table to calculate BGA pad stacks, but the Library Expert Preferences allows the User to change the values to whatever works best for you
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/bga-pad-size_topic2607_post10649.html
: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5484 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 27 Feb 2020 at 11:31am The IPC mathematical model uses this table to calculate BGA pad stacks, but the Library Expert Preferences allows the User to change the values to whatever works best for you
| https://www.eptac.com/webinar/addressing-the-issues-around-solder-joint-voids-in-surface-mount-components/
Addressing the Issues Around Solder Joint Voids in Surface Mount Components | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys
| https://www.eptac.com/are-voids-in-solder-joints-really-an-issue/
Are Voids in Solder Joints Really an Issue? - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/webinars/addressing-the-issues-around-solder-joint-voids-in-surface-mount-components/
Addressing the Issues Around Solder Joint Voids in Surface Mount Components - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/webinars/addressing-the-issues-around-solder-joint-voids-in-surface-mount-components
Addressing the Issues Around Solder Joint Voids in Surface Mount Components - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
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