Partner Websites: bgas (Page 1 of 22)

Introducing the new Nordson Matrix Planar CT

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/matrix/about-us/news/introducing-the-new-nordson-matrix-planar-ct

: Densely populated and double-sided PCBAs Opposing and symmetrical BGAs Dense PoP/SiP designs Flip chips, Cu Pillars and Micro-BGAs Connectors and PTH In This Section About Us Company History News

ASYMTEK Products | Nordson Electronics Solutions

3D - Planar CT

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/matrix/technologies/3d-planar-ct

: Densely populated and double-sided PCBAs Opposing and symmetrical BGAs Dense PoP/SiP designs Flip chips, Cu Pillars and Micro-BGAs Connectors and PTH In This Section Technologies 2D - Transmission

ASYMTEK Products | Nordson Electronics Solutions

PCB Assembly | Nordson YESTECH

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/solutions/pcb-assembly

. But AOI PCB systems can analyze only visible features. With the advent of BGAs, micro-BGAs, chip-scale packages (CSPs), flip chips and other hidden-connection devices, component and board manufacturers also utilize X-ray systems

ASYMTEK Products | Nordson Electronics Solutions

PCB Libraries Forum : Query Environment at the End of BGA Footprint Name

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_query-environment-at-the-end-of-bga-footprint-name_topic888.xml

.  Query Environment at the End of BGA Footprint Name : Not sure what the intention is... Author: jamesheadSubject: 888Posted: 14 Mar 2013 at 4:29amNot sure what the intention is for footprints of BGAs but I was under the impression there is

PCB Libraries, Inc.

Addressing the Issues Around Solder Joint Voids in Surface Mount Components - EPTAC - Train. Work Sm

| https://www.eptac.com/webinars/addressing-the-issues-around-solder-joint-voids-in-surface-mount-components/

. It seems to continue to appear. Someone, somewhere has found voids in their solder joints on BGAs, or other surface mounted components

Addressing the Issues Around Solder Joint Voids in Surface Mount Components - EPTAC - Train. Work Sm

| https://www.eptac.com/webinars/addressing-the-issues-around-solder-joint-voids-in-surface-mount-components

, we are still discussing this issue. It seems to continue to appear. Someone, somewhere has found voids in their solder joints on BGAs, or other surface mounted components

Altium Import BGA Bugs - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/altium-import-bga-bugs_topic346_post1496.html

    Posted: 13 Jun 2012 at 4:45pm Altium does not import PADs library parts for BGAs correctly. Currently the only way to get the BGA data imported into Altium correctly is to place the BGA in a PADs design, then export the board from PADs in ASCII, then import the PCB ASCII file in to Altium

PCB Libraries, Inc.

Altium Import BGA Bugs - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/altium-import-bga-bugs_topic346_post8751.html

. Until then you can import your BGAs and other alphanumeric numbered parts using ASCII output. Randy Clemmons Members Profile Send Private Message Find Members Posts Add to Buddy List Advanced User Joined

PCB Libraries, Inc.

Altium Import BGA Bugs - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic346&OB=ASC.html

    Posted: 13 Jun 2012 at 4:45pm Altium does not import PADs library parts for BGAs correctly. Currently the only way to get the BGA data imported into Altium correctly is to place the BGA in a PADs design, then export the board from PADs in ASCII, then import the PCB ASCII file in to Altium

PCB Libraries, Inc.

IPC-7095C – The Definitive Source for Everything BGA - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/webinars/ipc-7095c-the-definitive-source-for-everything-bga/

the electronic devices that make this all possible. The BGA. IPC-7095C “Design and Assembly Process Implementation for BGAs” is fast becoming the key source for dealing with the assembly of this interconnection technology into the products of today

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