| http://etasmt.com/cc?ID=te_news_industry,3761&url=_print
(since board-level reliability testing is more difficult to implement). As a prudent approach, most companies perform both component- and board-level SJR testing before releasing a product with previously uncharacterized solder joint systems
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/?cpn=0
" 0.008" Testing No Yes SMD Side None Top Side Bottom Side Both Sides SMD Pitch N/A 0.015" 0.020" 0.025" over 0.025" SMD Pads Smallest Hole 0.010" 0.011" 0.012" 0.013" 0.014" 0.015" over
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/?cpn=5
" 0.008" Testing No Yes SMD Side None Top Side Bottom Side Both Sides SMD Pitch N/A 0.015" 0.020" 0.025" over 0.025" SMD Pads Smallest Hole 0.010" 0.011" 0.012" 0.013" 0.014" 0.015" over
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/?cpn=2
" 0.008" Testing No Yes SMD Side None Top Side Bottom Side Both Sides SMD Pitch N/A 0.015" 0.020" 0.025" over 0.025" SMD Pads Smallest Hole 0.010" 0.011" 0.012" 0.013" 0.014" 0.015" over
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=3
0.025", smallest hole 0.015", all Plated holes, smallest trace/space 0.007", Green LPI Mask, White Top Silkscreen, Individual board with Single circuit design and No Multiple images of boards. File type: 274x required. No paint
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=2
) LF HASL OSP ENIG2U"-5U" (Immersion Gold), Immersion Tin, Immersion Silver from Taiwan or China Minimum Trace/Space 0.005" 0.006" 0.007" 0.008" Testing No Yes SMD Side None Top Side Bottom Side Both Sides SMD Pitch N/A
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=5
) LF HASL OSP ENIG2U"-5U" (Immersion Gold), Immersion Tin, Immersion Silver from Taiwan or China Minimum Trace/Space 0.005" 0.006" 0.007" 0.008" Testing No Yes SMD Side None Top Side Bottom Side Both Sides SMD Pitch N/A
| http://etasmt.com:9060/te_news_industry/2013-04-05/3761.chtml
(since board-level reliability testing is more difficult to implement). As a prudent approach, most companies perform both component- and board-level SJR testing before releasing a product with previously uncharacterized solder joint systems
| http://etasmt.com/te_news_industry/2013-04-05/3761.chtml
(since board-level reliability testing is more difficult to implement). As a prudent approach, most companies perform both component- and board-level SJR testing before releasing a product with previously uncharacterized solder joint systems
Whizz Systems | https://www.whizzsystems.com/embedded-technology-back/
. Our experienced engineers have developed diagnostic tools and application for board bring up and validation. The utilities have been used for testing various high-speed interfaces like DDR USB PCIe RGMII SGMII QSGMII UART I2C SPI For boards that require running Linux/BSD based OS, our engineers configure
