ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/industries/construction-and-architectural/insulation-and-roofing?con=t&page=28
manufacturing applications. Thorough coverage provides bonds and seals, watertight when necessary, between layers of these building materials and can provide durable bonds for installation on job sites
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/industries/construction-and-architectural/insulation-and-roofing?con=t&page=33
manufacturing applications. Thorough coverage provides bonds and seals, watertight when necessary, between layers of these building materials and can provide durable bonds for installation on job sites
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/industries/construction-and-architectural/insulation-and-roofing?con=t&page=34
manufacturing applications. Thorough coverage provides bonds and seals, watertight when necessary, between layers of these building materials and can provide durable bonds for installation on job sites
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/industries/construction-and-architectural/insulation-and-roofing?con=t&page=5
manufacturing applications. Thorough coverage provides bonds and seals, watertight when necessary, between layers of these building materials and can provide durable bonds for installation on job sites
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/industries/construction-and-architectural/insulation-and-roofing?con=t&page=6
manufacturing applications. Thorough coverage provides bonds and seals, watertight when necessary, between layers of these building materials and can provide durable bonds for installation on job sites
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-force-pull?con=t&page=6
. Please consult us for further details. Products Content Your results for: High Force Pull 4600-W Automated BondTester Nordson DAGE The 4600-W Bondtester can automatically complete shear and pull test patterns with different orientations of bonds, while recording failure
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0305-smart-card-delaminations
. Result Delaminations (black areas) are visible at several points along the induction coil. In addition, the wire bonds do not appear to be bonded to their pads
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2518-lead-delaminations
. Result The red and yellow areas are delaminations at these interfaces. These delaminations are a threat to reliability because they are close to the exterior of the package and provide a pathway by which moisture and contaminants can find their way to the wire bonds
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/test-types-2020/vector-pull
Anschlussdrähte von MBGA-Bauteilen auszuüben und um die Möglichkeit auszuschließen, dass der Pull-Haken in die Nähe des Halses des Bonds rutscht
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2466-multiple-voids
. Common defects in the flip chip underfill region are voids, delaminations, cracks and failure of solder bump bonds. Each of the four voids is in contact with a solder bump
