Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
phases in the Pb-free microstructure. RESULTS Solder Joint Void Characterization The factory x-ray inspection on the conventional or standard SMT (STD SMT) reflow assembly revealed substantial void content in the BGA solder joints of both components. The x
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
phases in the Pb-free microstructure. RESULTS Solder Joint Void Characterization The factory x-ray inspection on the conventional or standard SMT (STD SMT) reflow assembly revealed substantial void content in the BGA solder joints of both components. The x
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
phases in the Pb-free microstructure. RESULTS Solder Joint Void Characterization The factory x-ray inspection on the conventional or standard SMT (STD SMT) reflow assembly revealed substantial void content in the BGA solder joints of both components. The x
40731 | https://www.smta.org/harsh/Harsh-Environments-Conference-Program-2020.pdf
Surface Mount Technology Association (SMTA)
Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/
. Session topics include: Automotive Reliability Reliability of Leadless and Bottom Terminated Components Electronics Reliability Climatic Reliability Solder Material Advancement for Harsh Environments Click here to view a
Surface Mount Technology Association (SMTA) | https://www.smta.org/icehet/workshops.cfm
). - Voids, bridging, and head-in-pillow failures in bottom terminated components (BTC). We will also discuss how artificial intelligence (AI) is changing the way we think about x-ray inspection. Things we would never dream of doing just a few years ago are
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4798
: Bottom Terminated Components, J-STD-001, Flux Residues, Reliability, Warranty, Surface Insulation Resistance Members download articles for free: Log in now! Not a member yet
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
) Tin Whiskers Wafer Level Packaging (WLP) Assembly: 01005/03015 Components/Assembly 3D Board Assembly Additive Manufacturing SMT Adhesives Alternate Solder Alloys BGA/CSP Assembly Bottom Terminated Components Cavity Board Assembly Cleaning, Conformal
| https://www.eptac.com/faqs/ask-helena-leo/ask/air-bubbles-or-voids-in-solder-joints
. The only documents that discuss this from an IPC perspective are IPC-A-610 in section 8.3.12 Surface Mount Area Array, IPC-7093 – Design and Assembly Process Implementation for Bottom Termination Components and IPC-7095C
| https://www.eptac.com/ask/air-bubbles-or-voids-in-solder-joints/
. The only documents that discuss this from an IPC perspective are IPC-A-610 in section 8.3.12 Surface Mount Area Array, IPC-7093 – Design and Assembly Process Implementation for Bottom Termination Components and IPC-7095C