| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-removal-on-bottom-only-smt-rf-components
Gold Removal on Bottom Only SMT RF Components - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-touching-glass-body-components-like-diodes
: IPC-610 has many areas that are left to ones interpretation. The area for solder touching glass body components is one of them. The IPC mentions this along with the subject of maximum fillet height and the image that sets in some... Question
| https://www.eptac.com/ask/solder-touching-glass-body-components-like-diodes/
: IPC-610 has many areas that are left to ones interpretation. The area for solder touching glass body components is one of them. The IPC mentions this along with the subject of maximum fillet height and the image that sets in some peoples minds is that
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/when-should-a-pad-use-windowpane-paste-mask_topic2600_post10599.html
– and/or simply very large bottom-termination pads – where there is no paste recommendation in the datasheet – or in some cases, not even a basic land-pattern recommendation, or one that is obviously sub-optimal. One example
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/when-should-a-pad-use-windowpane-paste-mask_topic2600_post10602.html
– and/or simply very large bottom-termination pads – where there is no paste recommendation in the datasheet – or in some cases, not even a basic land-pattern recommendation, or one that is obviously sub-optimal. One example
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2600&OB=ASC.html
– and/or simply very large bottom-termination pads – where there is no paste recommendation in the datasheet – or in some cases, not even a basic land-pattern recommendation, or one that is obviously sub-optimal. One example
1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_aoi_mvp.html
. System can inspect SMT components pre-or post solder for presence / absence and placement verification (x,y,and theta ) polarity, solder fillet, bridging, solder opens, insufficient fillets, excess solder, and lifted leads
