| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-removal-on-bottom-only-smt-rf-components
. This can be a very time consuming process if there is a large quantity of components. I would suggest finding a company that tins components as their business as they would automate this process and provide you with the results you are looking for on those bottom only terminations and castellations
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
: 4.5.1, Gold Removal Issues Question: Since we are seeing more and more components with gold finish on the solder attachment pads(specifically, leadless ICs mostly with bottom side terminations only for RF circuitry
| https://www.eptac.com/faqs/ask-helena-leo/ask/spacing-of-radial-components-off-a-printed-circuit-board
: What is the spacing requirements between the board and the bottom edge of the component that doesn’t have a spacer or insulator in a supported through-hole terminations? Question
| https://ipcapexexpo.org/ipc-apex-expo-2021-professional-development-courses
| Rochester Institute of Technology PD02: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead
| https://www.eptac.com/faqs/ask-helena-leo/page/8
(specifically, leadless ICs mostly with bottom side terminations only for RF circuitry), how would you propose we meet the J-STD requirement
| https://www.eptac.com/faqs/ask-helena-leo/page/7
? Read More Darkened SMT Capacitor or Resistor Terminations After LeadFree Soldering Reflow QUESTION Question: Lately some of our terminations on SMT caps and resistors look dark, almost purple, like they have been overheated during the reflow process in a lead free environment
| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-touching-glass-body-components-like-diodes
, “…solder does not extent further on the component body” is not just for excess solder coming over the top of the component body, it is for any solder touching the component body, being either the bottom of the component, the sides of the component, or the
| https://www.eptac.com/ask/solder-touching-glass-body-components-like-diodes/
, “…solder does not extent further on the component body” is not just for excess solder coming over the top of the component body, it is for any solder touching the component body, being either the bottom of the component, the sides of the component, or the
| https://www.eptac.com/soldertips/solder-paste-shelf-life-and-testing/
. All three work together to create the rheology of the solder paste. The size of the powder allows the paste to be used for specific size terminations, the flux is selected to reduce the oxides on the materials being soldered and the viscosity agent being able to
| https://www.eptac.com/wp-content/uploads/2007/10/webinar_eptac_10_17_07.pdf
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