| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-selection-for-printed-circuit-boards-and-terminals
Solder Selection for Printed Circuit Boards and Terminals - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
The Last Will And Testament of the BGA Void THE LAST WILL AND TESTAMENT OF THE BGA VOID David Hillman, Dave Adams, Tim Pearson, Brad Williams, Brittany Petrick, and Ross Wilcoxon Rockwell Collins
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
The Last Will And Testament of the BGA Void THE LAST WILL AND TESTAMENT OF THE BGA VOID David Hillman, Dave Adams, Tim Pearson, Brad Williams, Brittany Petrick, and Ross Wilcoxon Rockwell Collins
| https://www.eptac.com/ask/solder-selection-for-printed-circuit-boards-and-terminals/
Solder Selection for Printed Circuit Boards and Terminals - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
. The test boards were fabricated with Panasonic R-1755V high temperature PCB laminate and Entek HT Plus organic solderability preservative (OSP) final finish
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/materials-available/
. We typically use Isola and Nanya products, as well as other options right for your project. Our high Tg material is specially formulated for superior performance through multiple thermal excursions, passing 6x solder tests at 288 degrees C
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/technology-roadmap/
• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control
40731 | https://www.smta.org/harsh/Harsh-Environments-Conference-Program-2020.pdf
Surface Mount Technology Association (SMTA)
