PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic538&OB=ASC.html
for calculating trace widths and via sizes for optimizing current capacity. Via holes are typically plugged when using via-in-pad technology and this includes via-in-thermal pad for QFN's
GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-User-Guide-801-1-07.pdf
capacity (Item 2). a) Select a die type based on the type of component to be formed. See 5.3.1 Select Dies, steps 1 and 2. b) Select dies to install based on the wire diameter of the component to be processed. Example: "3045" marked on the die pair as in
GPD Global | https://www.gpd-global.com/pdf/lead-former/CF8-User-Guide-801-1-07.pdf
capacity (Item 2). a) Select a die type based on the type of component to be formed. See 5.3.1 Select Dies, steps 1 and 2. b) Select dies to install based on the wire diameter of the component to be processed. Example: "3045" marked on the die pair as in
GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-Doc-Package-801-1-01.pdf
capacity (Item 2). a) Select a die type based on the type of component to be formed. See 5.3.1 Select Dies, steps 1 and 2. b) Select dies to install based on the wire diameter of the component to be processed. Example: "3045" marked on the die pair as in
GPD Global | https://www.gpd-global.com/pdf/lead-former/CF8-Doc-Package-801-1-01.pdf
capacity (Item 2). a) Select a die type based on the type of component to be formed. See 5.3.1 Select Dies, steps 1 and 2. b) Select dies to install based on the wire diameter of the component to be processed. Example: "3045" marked on the die pair as in
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