Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/flux.pdf
. Removal of a cooling module while running product through the oven may result in flux vapors escaping out the end tunnels and may also affect zone temperatures within the oven
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/071117-three-external-factors-that-can-wreck-dispensing-outcomes
. These are just a few external factors that can affect your dispensing outcomes. Do you know of any others we could add? Feel free to submit them to marketing@nordsonefd.com
| https://unisoft-cim.com/solder.php
PCB Selective Soldering Machine Programming Software ( flux / solder files) Thru-hole THD | Unisoft ≡ Menu Skip navigation For over 35 years, Intelligent PCB Manufacturing Automation Software Be production ready in minutes, not days
| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf
that transfer dissolved flux residue onto contact surfaces. NOTE This can be the case for switches, potentiometers or connectors. f. The supplier shall use solvents in conformance with ECSS‐Q‐ST‐70‐08, clause 6.4h. 17 ECSS‐Q‐ST‐70‐18C
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-36-wave-soldering-insufficient-fill-and-voids-in-pth
. Board thickness, finished hole size, board plating material, flux type and application method and type of solder all affect this possible defect
| https://www.eptac.com/webinars/developing-implementing-and-maintaining-processes-to-001-610/
Assemblies, but did you know how these documents are updated and maintained by their associated IPC Committees? Learn how you can and should be a part of these ever changing documents and how to submit recommendations to affect change and consistency for the betterment of your company and others
| https://www.eptac.com/webinars/developing-implementing-and-maintaining-processes-to-001-610
of Electronic Assemblies, but did you know how these documents are updated and maintained by their associated IPC Committees? Learn how you can and should be a part of these ever changing documents and how to submit recommendations to affect change and consistency for the betterment of your company and others
| https://www.eptac.com/soldertip/soldertip-36-wave-soldering-insufficient-fill-and-voids-in-pth/
) and the occurrence of voids in barrels. Board thickness, finished hole size, board plating material, flux type and application method and type of solder all affect this possible defect
| https://www.eptac.com/soldertips/solder-paste-shelf-life-and-testing/
. Whether or not the solder paste can be used, would depend upon the type of flux being used, be it either a low activity, medium activity, or high activity flux
| https://www.eptac.com/webinar/new-amendments-to-ipc-a-610f-j-std-001f-and-what-you-need-to-know/
corrections to the current document revisions, but additional requirements not previously mentioned in the existing standards. Join us for a moment as we review the new amendments, what corrections exist, how they affect your current requirements, the new specifications and how this all impacts the current online testing system
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