412 can flux on bga cause short results

(cont.) •  Q:  How  are  these  acflux  types?   •  Depending  on  the  results  from  these  tests  the   manufacture  can  now  qualify  the  flux  type.   Flux Friend or Foe

| https://www.eptac.com/wp-content/uploads/2014/05/eptac_06_18_14.pdf

Seamark/Zhuomao Model ZM-R7220A Freightliner CPC, CPC4 Repair Package – Precision PCB Services, Inc.

Precision PCB Services, Inc | https://precision-pcb-services-inc.com/collections/bga-rework-stations/products/seamark-zhuoman-model-zm-r7220a-freightliner-cpc-cpc4-repair-package

- $25,000.00 USD Quantity Add to Cart With the Zhuomao ZM-R7220A you can repair Freightliner CPC and CPC4 Modules.  This package includes the equipment, supplies, process documentation and hands on training in how to remove, prep, reball and re-install CPC Module BGA Components

Precision PCB Services, Inc

SolderTips | EPTAC

| https://www.eptac.com/solder-tips/

. Does turning up the solder pot too high cause impurities to collect on parts? Can you comment on this? Read Answer What’s with the expiration dates on solder paste or wire? Question

PCBA Cleaning Machine / PCB Defluxing -For Best Coating and Bonding Effect - I.C.T SMT Machine

| https://www.smtfactory.com/PCBA-Cleaning-Machine-PCB-Defluxing-For-Best-Coating-and-Bonding-Effect-id43566387.html

. Prevent component and PCB corrosion Flux residues left on electronic circuit boards are acidic. If they are not removed through a cleaning process, the residue can absorb ambient moisture from the air and cause corrosion of component leads and PCB contacts

00600-248

Heller 公司 | http://hellerindustries.com.cn/00600-248.pdf

00600-248 With solder reflow, relying on commonlyaccepted practices can lead engineers tooverlook some relatively simple factors thatare critical to optimizing the process

Heller 公司

Heated Stage X-ray inspection

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/blog/heated-stage

. Head-in-pillow One of the most commonly looked for defects is Head-In-Pillow or HIP. Often seen in Ball Grid Array (BGA) device connections post reflow, where the BGA ball and solder paste on the PCB pad do not form a cohesive joint

ASYMTEK Products | Nordson Electronics Solutions

Soldertips

| https://www.eptac.com/faqs/soldertips?hsLang=en

. Does turning up the solder pot too high cause impurities to collect on parts? Can you comment on this? Read More What’s with the expiration dates on solder paste or wire

Soldertips

| https://www.eptac.com/faqs/soldertips

. Does turning up the solder pot too high cause impurities to collect on parts? Can you comment on this? Read More What’s with the expiration dates on solder paste or wire

PCB Libraries Forum : Electronic Components--Resistor

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_electronic-componentsresistor_topic2522.xml

. It can cause changes in electron flux. The smaller the resistor, the greater the flux of electrons and vice versa. Most of the time, the resistors we used are with fixed values

PCB Libraries, Inc.

. The separated flux forms a puddle underneath the blower housing within the flux separation box. This accumulation can be easily removed at regular intervals ranging from monthly to yearly depending on throughput and flux type (Photo 2

46969 | https://hellerindustries.com/wp-content/uploads/2018/07/fluxwp.pdf

Heller Industries Inc.

46969