GPD Global | https://www.gpd-global.com/fluid-dispense-solderpaste-dispenser.php
Solder Paste Dipsense Systems -Dots, Lines, Complex Shapes, 01005, 0402 Home Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader
GPD Global | https://www.gpd-global.com/solder-paste-dispense-systems.php
Solder Paste Dipsense Systems -Dots, Lines, Complex Shapes, 01005, 0402 Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
Surface Mount Technology Association (SMTA) | https://www.smta.org/training/smt-assembly-process-basics-videos.cfm
SMTA - Surface Mount Technology Association 中文 MEMBERS LOGIN Membership Become a Member! Renew Membership About SMTA Ambassadors Benefits Classifications Member Directory Member Directory Corporate Suppliers Corporate Users Consultants List Advertisers Update Your Info
Lewis & Clark | https://www.lewis-clark.com/
Used Surface Mount I Pre-owned PCB Assembly - Lewis and Clark, Inc. Skip to content My Cart: $ 0.00 0 View Cart Checkout No products in the cart. Subtotal
GPD Global | https://www.gpd-global.com/co_website/fluiddispense-prod-precisionauger.php
. With the introduction of our newest 062 diameter auger, this pump can repeatedly dispense solder paste for 01005 components. The Precision Auger pump also interfaces with our Real Time Process Control System (FPC
GPD Global | https://www.gpd-global.com/fluiddispense-prod-precisionauger.php?utm_source=PAnewsINT08_2016
. With the introduction of our newest 062 diameter auger, this pump can repeatedly dispense solder paste for 01005 components. The Precision Auger pump also interfaces with our Real Time Process Control System (FPC
GPD Global | https://www.gpd-global.com/precision-auger-pump.php
. With the introduction of our newest 062 diameter auger, this pump can repeatedly dispense solder paste for 01005 components. The Precision Auger pump also interfaces with our Real Time Process Control System (FPC
Baja Bid | https://bajabid.com/wp-content/uploads/2021/05/MY300-SX-Brochure.pdf
– MIDAS Component range Chip (from 01005), SOIC, PLCC, TSOP, QFP, BGA, flip chip, odd- shape, surface-mount connectors, through-hole components, CSP, CCGA, DPAK, Alcap, Tantalum Component specification Min: 0.4 x 0.2 mm (0.016” x 0.008”) (01005) Max: 140 x 73 x 15 mm (5.51” x 2.87” x 0.59”) (1) Max: component weight: 140 g (2) (1) With 4K vision
GPD Global | https://www.gpd-global.com/co_website/fluiddispense-prod-dispensetech.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
GPD Global | https://www.gpd-global.com/fluiddispense-prod-dispensetech.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
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Eden Prairie, MN USA
Phone: 952-920-7682
