Partner Websites: cant 75% fill through hole (Page 1 of 2)

IPC-A-610 Revision F Paragraph 7.3.5.1 Supported Holes - Solder - Vertical Fill (A) - EPTAC - Train.

| https://www.eptac.com/faqs/ask-helena-leo/ask/ipc-a-610-revision-f-paragraph-7-3-5-1-supported-holes-solder-vertical-fill-a

. The segment of the document that covers the section for less than 14 leads and Class 2 requirements for 50% hole fill due to inner layer heat sinking was left out of the documents, and now in this revision of both 610 and 001, that particular section is missing

Ask Helena & Leo

| https://www.eptac.com/faqs/ask-helena-leo

. Having worked through the first test and... Read More 75% Barrel Fill Requirement for Class 2 Change in J-STD-001 Revision F QUESTION Question

Addressing Circular Mil Area (CMA) Buildup - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/addressing-circular-mil-area-cma-buildup

Nut Soldering Criteria Solder Flow Near Through-Hole Component Body Maximum Limits of Solder Bath Contamination Defining Standard Industry Practices for Torque of Threaded Fasteners Have a question

Cup Terminal Soldering Requirements - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/cup-terminal-soldering-requirements/

. The only important items in this situation are that the wire is inserted to the depth of the cup and that the solder fills 75% of the cup, which is very similar to soldering a wire into a plated through hole

Class 2 & Class 3 Inspection Standards in PCB Assembly | Imagineering

Imagineering, Inc. | https://www.pcbnet.com/blog/class-ii-vs-class-iii-inspection-standards-in-pcb-assembly/

. There is a difference between Class 2 and Class 3 when it comes to the amount of barrel fill that’s used in the through-hole leads

Imagineering, Inc.

South East Asia Technical Conference on Electronics Assembly | SMTA South East Asia

Surface Mount Technology Association (SMTA) | https://www.smta.org/southeast-asia/

. The related manufacturing personnel are well aware of common encumbering defects happen erratically with this process. Some of these defects encountered daily are bridging, solder skips, solder voids and insufficient barrel fill or hole-fill

Surface Mount Technology Association (SMTA)

Ask Questions | EPTAC

| https://www.eptac.com/ask/

: We have boards with PEM ® nuts being soldered during production. Has IPC established minimum soldering criteria for SMT PEM ® s? Read Answer Solder Flow Near Through-Hole Component Body Question

What is Class 3 Printed Circuit Board Fabrication? | Imagineering, Inc.

Imagineering, Inc. | https://www.pcbnet.com/blog/class-3-printed-circuit-board-fabrication/

. The required amount of barrel fill for through-hole leads is 50% for Class 2 PCBs, while that number is 75% for Class 3 PCBs. Inspection – Because Class 2 PCBs are not typically used harsh environments or scenarios requiring a high degree of functionality, inspection times are dramatically reduced

Imagineering, Inc.

ATE PCB TEST for EMS, CEM, OEM, ODM electronics manufacturer - PCB assembly / PCBA | Unisoft

| https://unisoft-cim.com/test-fixture_download.htm

. Fill in the VALID NET NUMBER field with MIN=0 and MAX=2000. Fill in the EXCLUDE RANGE #1 field with MIN=0 and MAX=15. FORCED PRE-ASSIGNED NET NUMBERS

Import/Export Guide for FLOware Software

GPD Global | https://www.gpd-global.com/co_website/pdf/doc/FLOware-Import-Export-Data-Reference-Guide-22100024R.pdf

. . . . . . . . . . . . . 66 Universal Constants. . . . . . . . . . . . . . . . . 67 Retention. . . . . . . . . . . . . . . . . . . . . . . . . 75 Fixed Locations. . . . . . . . . . . . . . . . . . . . 76 ErrorLog. . . . . . . . . . . . . . . . . . . . . . . . . . 79 Transfer. . . . . . . . . . . . . . . . . . . . . . . . . . 80 OffLine Operations

GPD Global

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