ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/sonoscan-applications/microelectronics
below demonstrate how our technology makes it easier to inspect and detect defects. PQFP Optical and acoustic images showing popcorn crack defect. PQFP
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0309-tsop-die-cracks
Note 309 Optical image of a TSOP, diagram showing defect, Acoustic image of large crack, Acoustic image showing a smaller crack. Sample & Method Two TSOPs were imaged on C-SAM from the top side
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes
Popcorn Crack 0299 PBGA Die Face Delaminations 0309 TSOP Die Cracks 0434 PQFPs Production Scanning 0759 TSOP Cracked Die 1009 PBGA Delaminations, Through Transmission 1011 PBGA Delaminations 1012 PBGA
| https://www.eptac.com/soldertips/problems-with-stress-cracks-in-ceramic-components/
. There is lots of talk these days about using hot air to reflow the caps as the thermal ramp up with the solder iron is too quick and will potentially crack the end termination from the body of the capacitor
| https://www.eptac.com/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components/
. There is lots of talk these days about using hot air to reflow the caps as the thermal ramp up with the solder iron is too quick and will potentially crack the end termination from the body of the capacitor
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components
. There is lots of talk these days about using hot air to reflow the caps as the thermal ramp up with the solder iron is too quick and will potentially crack the end termination from the body of the capacitor
| https://www.eptac.com/wp-content/uploads/2007/12/webinar_eptac_12_19_07.pdf
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0434-pqfp-production-scanning
. The circular gap-type defect pattern surrounding the die is typical of a popcorn crack resulting from the sudden expansion of trapped moisture
| https://www.eptac.com/wp-content/uploads/2013/08/eptac_08_21_13-1.pdf