42 capacitor crack defect results

•  Majority of failures were related to either: – Capacitors – Printed Circuit Boards Types of Capacitor Failures 24 25 Induced Crack Defects The major causes of Capacitor cracking are

| https://www.eptac.com/wp-content/uploads/2016/04/eptac_04_20_16.pdf

Microelectronics

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/sonoscan-applications/microelectronics

 below demonstrate how our technology makes it easier to inspect and detect defects.       PQFP     Optical and acoustic images showing popcorn crack defect.     PQFP

ASYMTEK Products | Nordson Electronics Solutions

TSOP DIE CRACKS

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0309-tsop-die-cracks

Note 309 Optical image of a TSOP, diagram showing defect, Acoustic image of large crack, Acoustic image showing a smaller crack. Sample & Method Two TSOPs were imaged on C-SAM from the top side

ASYMTEK Products | Nordson Electronics Solutions

Application Notes

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes

Popcorn Crack 0299 PBGA Die Face Delaminations 0309 TSOP Die Cracks 0434 PQFPs Production Scanning 0759 TSOP Cracked Die 1009 PBGA Delaminations, Through Transmission 1011 PBGA Delaminations 1012 PBGA

ASYMTEK Products | Nordson Electronics Solutions

SolderTips: Problems With Stress Cracks in Ceramic Components | EPTAC

| https://www.eptac.com/soldertips/problems-with-stress-cracks-in-ceramic-components/

. There is lots of talk these days about using hot air to reflow the caps as the thermal ramp up with the solder iron is too quick and will potentially crack the end termination from the body of the capacitor

SolderTips: Problems With Stress Cracks in Ceramic Components - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components/

. There is lots of talk these days about using hot air to reflow the caps as the thermal ramp up with the solder iron is too quick and will potentially crack the end termination from the body of the capacitor

SolderTips: Problems With Stress Cracks in Ceramic Components - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components

. There is lots of talk these days about using hot air to reflow the caps as the thermal ramp up with the solder iron is too quick and will potentially crack the end termination from the body of the capacitor

.  Crack extends from one cavity to another. Extrapolated from IPC/WHMA/A-620 16 Examples of Damaged Connectors/Contacts/Pins Defect – Class 1, 2, 3  Damaged contact.  Contact is bent. Extrapolated from IPC/WHMA/A-620 17 Examples of Damaged Connectors/Contacts/Pins Defect

| https://www.eptac.com/wp-content/uploads/2007/12/webinar_eptac_12_19_07.pdf

PQFP PRODUCTION SCANNING

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0434-pqfp-production-scanning

. The circular gap-type defect pattern surrounding the die is typical of a popcorn crack resulting from the sudden expansion of trapped moisture

ASYMTEK Products | Nordson Electronics Solutions

•  Head-on-Pillow phenomenon •  Standards and their adoption •  Reliability concerns 13 Limitations and Issues 3.5.8 Pad Cratering – defined as a separation of the pad from the PCB resin/weave composite or within the composite immediately adjacent to the pad, also know as “laminate crack

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