| https://www.eptac.com/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components/
. There is lots of talk these days about using hot air to reflow the caps as the thermal ramp up with the solder iron is too quick and will potentially crack the end termination from the body of the capacitor
| https://www.eptac.com/soldertips/problems-with-stress-cracks-in-ceramic-components/
. There is lots of talk these days about using hot air to reflow the caps as the thermal ramp up with the solder iron is too quick and will potentially crack the end termination from the body of the capacitor
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components
. There is lots of talk these days about using hot air to reflow the caps as the thermal ramp up with the solder iron is too quick and will potentially crack the end termination from the body of the capacitor
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
Monel Nichrome Nickel Nickel Iron / Alloy42 Nickel Silver Palladium Platinum Silver Solder Plated Stainless Steel Tin Titanium Non-solderable Zinc Key Recommended Alloy Specific (contact EFD
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide
Monel Nichrome Nickel Nickel Iron / Alloy42 Nickel Silver Palladium Platinum Silver Solder Plated Stainless Steel Tin Titanium Non-solderable Zinc Key Recommended Alloy Specific (contact EFD
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
, Jörg Trodler, Adam Murling Abstract 2018 31-2 Fill The Void III Tony Lentz Abstract 31-2 Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate - Influence of Eigenmodes
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
Cost of Gold, Copper, Palladium, Silver, tin etc Protective coatings and effects of soldering operations Solderability reflow wetting patterns Solderability tests: Dip and inspect, wetting balance, rotary dip test Simple
Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/
problem with the soldering uniformity. More # of PCB layers, larger internal connections, thicker Cu ground layers and poor Cu balance that in some cases cannot be fix by designers difficult current soldering processes narrowing process window and reduce
Surface Mount Technology Association (SMTA) | https://www.smta.org/news/smta_calendar/calendar.cfm
. Barrel fill issues are becoming every day more complex, Large assemblies with hundreds of TH quantities in large assemblies create a problem with the soldering uniformity. More
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