| http://etasmt.com/cc?ID=te_news_bulletin,9161&url=_print
. Common defects and treatment methods of SMT reflow soldering: bridging Bridging can be said to be one of the most common defects. If a bridge defect occurs, it may cause a short circuit between device components
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
. Therefore if you are building class 3 product, you have a dilemma as initiating this requirement may cause manufacturing problems with component coplanarity
| http://etasmt.com/te_news_bulletin/2019-08-05/9161.chtml
. Common defects and treatment methods of SMT reflow soldering: bridging Bridging can be said to be one of the most common defects. If a bridge defect occurs, it may cause a short circuit between device components
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. Composite epoxy and phase-change polymer TIMs have limited heat spreading capacity and are strongly affected by any assembly coplanarity issues
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
., Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephani Gulbrandsen, Julie Silk, Alex Chiu, and Yew-Hoong Chan Abstract 26-4 Is a High Phosphorus Content in the Nickel Layer A Root Cause for Black Pad on ENIG Finishes? Dipl.-Ing. Mustafa Özkök, Joe
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