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substrate by using patented tweezer jaws. Tests are performed in accordance with: JEDEC JESD22-B115 JEITA EIAJ ET-7407 IPC-9708 The cold bump pull jaws have a cavity etched into it to match as closely as possible to the diameter of the solder ball being tested
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/cold-bump-pull?con=t&page=3
The cold bump pull jaws have a cavity etched into it to match as closely as possible to the diameter of the solder ball being tested
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5246
. On the basis of the volume change associated with the polymorphic transformation it was hypothesized that in the constrained conditions of a solder joint the stresses generated could cause the
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