ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/070120-medical-manufacturing-ways-to-improve-fluid-dispensing-control
caused problems such as over spray and inconsistent fluid patterns. When the medical manufacturer changed to a spray valve and spin cap from a different source, the over spray and application problems disappeared
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/RSS_library-expert-2018-06-released_topic2360.xml
1.60 mm in length, the incorrect terminal type was usedFixed 2 issues in the PSON component family:When Pin 1 was longer than the other pins, it caused the solder mask to swell for violating the Minimum Solder Mask Spacing RuleFor parts under
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2581-multiple-voids
. Result The numerous dark circular features are voids at the interface between the wafers. Circular voids are often caused by very tiny particles of SiO2 or other solid contaminants
| http://etasmt.com/cc?ID=te_news_bulletin,27161&url=_print
. Rehm is an excellent company in SMT industry field, which is worthy of learning and respect from all I.C.T. 5. I.C.T apologizes again for the inconvenience and distress caused to Rehm team
| http://etasmt.com/cc?ID=te_news_industry,3761&url=_print
; 2) creep failure, or damage caused by a long-lasting permanent load or stress; and 3) fatigue, or damage caused by cyclical loads or stresses
| https://www.eptac.com/wp-content/uploads/2021/11/eptac_03_14_12.pdf
| http://etasmt.com/cc?ID=te_news_bulletin,23571&url=_print
. It is typically caused by force imbalances during the reflow soldering process. Process and design-related causes: • Improper pad design
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0900-delaminations-and-cracks
. These areas are delaminations either within the stack of the cell or between the cell and the silicone layer behind it. The large black lines running from the top of the image to the bottom are cracks in the glass facing sheet caused by a burn out
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0354-flip-chip
. These are vertical delaminations between the underfill and bump caused by a failure of the fluid underfill to thoroughly wet the bump
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/products/front-end-components/eliminator-tips
: Reduced cost through elimination of costly mold repair caused by strings pulling across mold face Wide application window - works on highly crystalline, semi-crystalline and shear sensitive materials Features
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