ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2581-multiple-voids
. Result The numerous dark circular features are voids at the interface between the wafers. Circular voids are often caused by very tiny particles of SiO2 or other solid contaminants
| http://etasmt.com/cc?ID=te_news_bulletin,27161&url=_print
. Rehm is an excellent company in SMT industry field, which is worthy of learning and respect from all I.C.T. 5. I.C.T apologizes again for the inconvenience and distress caused to Rehm team
| http://etasmt.com/cc?ID=te_news_industry,3761&url=_print
; 2) creep failure, or damage caused by a long-lasting permanent load or stress; and 3) fatigue, or damage caused by cyclical loads or stresses
| https://www.eptac.com/wp-content/uploads/2021/11/eptac_03_14_12.pdf
| http://etasmt.com/cc?ID=te_news_bulletin,23571&url=_print
. It is typically caused by force imbalances during the reflow soldering process. Process and design-related causes: • Improper pad design
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0900-delaminations-and-cracks
. These areas are delaminations either within the stack of the cell or between the cell and the silicone layer behind it. The large black lines running from the top of the image to the bottom are cracks in the glass facing sheet caused by a burn out
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0354-flip-chip
. These are vertical delaminations between the underfill and bump caused by a failure of the fluid underfill to thoroughly wet the bump
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/products/front-end-components/eliminator-tips
: Reduced cost through elimination of costly mold repair caused by strings pulling across mold face Wide application window - works on highly crystalline, semi-crystalline and shear sensitive materials Features
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0309-tsop-die-cracks
; the crack at the center of the package at lower right above is much smaller. The location of both cracks in the center of the die suggests that they may have been caused by handling
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1058-lead-delaminations
. Gating includes the lead frame, paddle and die surface. Result The unusually symmetrical pattern of the delaminations (red) of the molding compound from the leads is probably caused by incompatible tinning of the leads
