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the design and/or manufacture of the component. Process and design-related causes: • Improper fabrication of the component • Improper design of the component
Heller Industries Inc. | https://hellerindustries.com/dull-solder-joints/
(though there can be other causes). The more slowly a joint cools, the coarser the grain growth and, conversely, the faster the joint cools, the finer the grain growth and the shinier the joint
Heller Industries Inc. | https://hellerindustries.com/bridging-defects/
. Process and design-related causes of PCB Bridging Defects: Excessive volume of solder due to improper pad dimension Excessive volume of solder due to improper stencil aperture Improper application of solder mask Excessive slump of solder paste Reflow-related causes
Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects/
. Their formation is promoted by excessive oxides in the solder paste that inhibit solder coalescence during reflow. Solder ball defects are probably the most common reflow solder defect, and there are many causes of solder ball defects beyond the system that will contribute to their formation
Heller Industries Inc. | https://hellerindustries.com/solder-ball-defects/
. Their formation is promoted by excessive oxides in the solder paste that inhibit solder coalescence during reflow. Solder ball defects are probably the most common reflow solder defect, and there are many causes of solder ball defects beyond the system that will contribute to their formation
Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects
. Their formation is promoted by excessive oxides in the solder paste that inhibit solder coalescence during reflow. Solder ball defects are probably the most common reflow solder defect, and there are many causes of solder ball defects beyond the system that will contribute to their formation
Heller Industries Inc. | https://hellerindustries.com/opensor-insufficient-solder/
: insufficient solder The solder joint is incomplete resulting in an open circuit or a weak interconnection. Process and design-related causes of insufficient solder
Heller Industries Inc. | https://hellerindustries.com/nonwetting/
. Process and design-related causes of PCB Nonwetting: Solder paste flux not aggressive enough for level of oxidation present on part or PCB PCB pad contaminated Component lead contaminated Excessive moisture absorbed by paste Paste exposed beyond
Heller Industries Inc. | https://hellerindustries.com/component-cracking/
the design and/or manufacture of the component. Process and design-related causes of component cracking: Improper fabrication of the component Improper design of the component Improper packaging of component during shipping Improper storage of components at incoming and on the manufacturing floor
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