| http://etasmt.com:9060/te_news_industry/2021-07-22/22761.chtml
: ² Data lost due to HDD damage. (Please back up the data periodically.) ² Malfunction of the system due to the execution of a program regardless of machine
| http://etasmt.com/cc?ID=te_news_bulletin,24964&url=_print
of repeatability and accuracy as well as very tight on-board ∆Ts. For example, if the process window is 10°C and the ∆T on the PCB is 10°C, the process would be running with a zero margin of error
| http://etasmt.com/te_news_bulletin/2021-09-02/24964.chtml
of repeatability and accuracy as well as very tight on-board ∆Ts. For example, if the process window is 10°C and the ∆T on the PCB is 10°C, the process would be running with a zero margin of error
| https://www.smtfactory.com/I-C-T-SMT-Vacuum-Reflow-Oven-Machine-helps-you-to-solve-the-problem-of-High-Solder-Voids-Rates-id45973467.html
also becomes an indicator of whether the product is qualified. The causes of these solder join voids are various, such as solder paste, PCB surface treatment, reflow temperature curve setting, reflow environment, solder pad design, microholes, solder pad empty, etc
| http://etasmt.com:9060/te_news_bulletin/2021-09-02/24964.chtml
of repeatability and accuracy as well as very tight on-board ∆Ts. For example, if the process window is 10°C and the ∆T on the PCB is 10°C, the process would be running with a zero margin of error
| http://etasmt.com/cc?ID=te_news_bulletin,23576&url=_print
the design and/or manufacture of the component. Process and design-related causes: • Improper fabrication of the component • Improper design of the component
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23576.chtml
the design and/or manufacture of the component. Process and design-related causes: • Improper fabrication of the component • Improper design of the component
| http://etasmt.com/te_news_bulletin/2021-08-31/23576.chtml
the design and/or manufacture of the component. Process and design-related causes: • Improper fabrication of the component • Improper design of the component
Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects
. Their formation is promoted by excessive oxides in the solder paste that inhibit solder coalescence during reflow. Solder ball defects are probably the most common reflow solder defect, and there are many causes of solder ball defects beyond the system that will contribute to their formation
| http://etasmt.com/cc?pageID=newsList&ID=te_news_bulletin,0&pNum=6
.). Show Details Process and design-related causes Process and design-related causes Show Details Wicking Defects A Wicking Defect is the flow of solder either up the lead of the component or along
