Imagineering, Inc. | https://www.pcbnet.com/blog/identifying-and-correcting-solder-bridge-defects/
. Unfortunately, there are numerous causes that can produce solder bridging. To produce as quickly and efficiently as possible, finding the root cause of this defect is critical
| http://etasmt.com/cc?ID=te_news_bulletin,23568&url=_print
. Solder ball defects are probably the most common reflow solder defect, and there are many causes of solder ball defects beyond the system that will contribute to their formation
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-248.pdf
. They include improved controls for interior air velocity, combined with the surface tension of solder paste, to hold bottom-side components in place and to eliminate the possibility of blowing the
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/00600-248-1.pdf
. They include improved controls for interior air velocity, combined with the surface tension of solder paste, to hold bottom-side components in place and to eliminate the possibility of blowing the
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/when-should-a-pad-use-windowpane-paste-mask_topic2600_post10599.html
: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5184 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 01 Feb 2020 at 4:40pm The Paste Mask reduction is specifically used to prevent the package from sitting on top of a large blob of solder to prevent rocking or teeter-totter so that one side of the package is up in the
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/when-should-a-pad-use-windowpane-paste-mask_topic2600_post10602.html
: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5183 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 01 Feb 2020 at 4:40pm The Paste Mask reduction is specifically used to prevent the package from sitting on top of a large blob of solder to prevent rocking or teeter-totter so that one side of the package is up in the
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2600&OB=ASC.html
: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5449 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 01 Feb 2020 at 4:40pm The Paste Mask reduction is specifically used to prevent the package from sitting on top of a large blob of solder to prevent rocking or teeter-totter so that one side of the package is up in the
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23568.chtml
. Their formation is promoted by excessive oxides in the solder paste that inhibit solder coalescence during reflow. Solder ball defects are probably the most common reflow solder defect, and there are many causes of solder ball defects beyond the system that will contribute to their formation
| http://etasmt.com/te_news_bulletin/2021-08-31/23568.chtml
. Their formation is promoted by excessive oxides in the solder paste that inhibit solder coalescence during reflow. Solder ball defects are probably the most common reflow solder defect, and there are many causes of solder ball defects beyond the system that will contribute to their formation
| https://www.eptac.com/blog/5-common-solder-mistakes-and-how-to-resolve-them
: What causes insufficient wetting in soldering? A: Insufficient wetting refers to solder that doesn’t spread evenly across the surface of the joint or
