Partner Websites: causes of solder splash (Page 1 of 563)

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms

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ASYMTEK Products | Nordson Electronics Solutions

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms

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ASYMTEK Products | Nordson Electronics Solutions

Solder Shorts

Heller Industries Inc. | https://hellerindustries.com/solder-shorts/

? Reflow Soldering Problems Overview Causes & Defects – Reflow Soldering Solder Ball Defects Opensor Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination

Heller Industries Inc.

Grainy Solder

Heller Industries Inc. | https://hellerindustries.com/grainy-solder/

? Reflow Soldering Problems Overview Causes & Defects – Reflow Soldering Solder Ball Defects Opensor Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination

Heller Industries Inc.

Process and design-related causes-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_bulletin,23570&url=_print

: • Non-coplanar leads on the component • Excessive warpage of the PCB or substrate • Poor wetting • Insufficient amount of solder due to improper printing parameters

Process and design-related causes-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23570.chtml

:3 Process and design-related causes: • Non-coplanar leads on the component • Excessive warpage of the PCB or substrate • Poor wetting • Insufficient amount of solder due to improper printing parameters

Process and design-related causes-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/te_news_bulletin/2021-08-31/23570.chtml

:3 Process and design-related causes: • Non-coplanar leads on the component • Excessive warpage of the PCB or substrate • Poor wetting • Insufficient amount of solder due to improper printing parameters

Process and design-related causes-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_bulletin,23570&url=comment

Process and design-related causes-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Home About I.C.T News Products Video Projects Service Join Us Contact Us Home About I.C.T

Dull solder joints

Heller Industries Inc. | https://hellerindustries.com/dull-solder-joints/

. Process and design-related causes of Dull Solder Joints: Impurity in the component plating Impurity in the circuit board finish Bad or expired solder paste Reflow-related causes of dull solder joints

Heller Industries Inc.

Opensor Insufficient Solder

Heller Industries Inc. | https://hellerindustries.com/opensor-insufficient-solder/

: insufficient solder The solder joint is incomplete resulting in an open circuit or a weak interconnection. Process and design-related causes of insufficient solder

Heller Industries Inc.

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Solder Paste Dispensing

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
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Component Placement 101 Training Course
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Reflow Soldering 101 Training Course
PCB Handling with CE

Software for SMT placement & AOI - Free Download.
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