PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2819&OB=ASC.html
Same chip size but different terminal metalization - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns New Posts FAQ Search Events Register
| https://www.eptac.com/soldertips/problems-with-stress-cracks-in-ceramic-components/
. There is lots of talk these days about using hot air to reflow the caps as the thermal ramp up with the solder iron is too quick and will potentially crack the end termination from the body of the capacitor
| https://www.eptac.com/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components/
. There is lots of talk these days about using hot air to reflow the caps as the thermal ramp up with the solder iron is too quick and will potentially crack the end termination from the body of the capacitor
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components
. There is lots of talk these days about using hot air to reflow the caps as the thermal ramp up with the solder iron is too quick and will potentially crack the end termination from the body of the capacitor
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
chip resistor is shown in Figure 13. Since Ag presents in the fracture area, it means that the fracture happens partially in the termination metallization and partially in the bulk solder joints. Since the shear area in termination metallization varies
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
chip resistor is shown in Figure 13. Since Ag presents in the fracture area, it means that the fracture happens partially in the termination metallization and partially in the bulk solder joints. Since the shear area in termination metallization varies
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Abstract 20-4 0.4 mm SOLDER BALL PITCH CHIP SCALE PACKAGING AND DROP TEST PERFORMANCE Geun Sik Kim and Dong Sik Kim Abstract 20-4 AN EXPERIMENTAL STUDY OF A COMPONENTS TERMINATION FINISH CONVERSION PROCESS: THE ROBOTIC STRIPPING AND SOLDER DIPPING PROCESS G
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