| https://www.eptac.com/soldertips/problems-with-stress-cracks-in-ceramic-components/
. Although it may not be seen at this time, the ceramic will fracture when exposed to heat cycles. Solder paste, Tin/Lead or Lead-Free. Lead-Free is more brittle and the stress relief will be absorbed by the component causing it to crack
| https://www.eptac.com/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components/
. Although it may not be seen at this time, the ceramic will fracture when exposed to heat cycles. Solder paste, Tin/Lead or Lead-Free. Lead-Free is more brittle and the stress relief will be absorbed by the component causing it to crack
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components
. Although it may not be seen at this time, the ceramic will fracture when exposed to heat cycles. Solder paste, Tin/Lead or Lead-Free. Lead-Free is more brittle and the stress relief will be absorbed by the component causing it to crack
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/sonoscan-applications/microelectronics
: PEM-INST-001 ESA/SCC Spec No.25200 Ceramic Chip Capacitors Discoidals, Filters, MLCCs, etc. Mil-PRF-123, 31033 & 49470 Die Attach Mil-STD-883
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/publications
Microelectronics - Flip Chip RECORDED ECHOES SOLVE TOUGH PROBLEMS As published in Electronic Design, January 2021 HIGH VOLTAGE CERAMIC CHIP CAPACITORS EVALUATION As published in Bodos Power March 2017 FLIPCHIPS
| https://www.smtfactory.com/Introduction-of-Lyra-Reflow-Oven-s-process-development-stage-id3093448.html
I.C.T Team Global Partners SMT Line-Up SMT Production Line Full-auto SMT Line Semi-auto SMT Line Reflow Oven Pyxis Series Reflow Oven Lyra Series Reflow Oven S Series Reflow Oven L Series Reflow Oven LV
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_jedec-standard-footprints_topic2063.xml
:46pmYou need separate Chip land patterns for Capacitors and Resistors. Capacitors should have a side fillet and Resistors do not. However, IPC says that the same pattern can be used for both because the Side Fillet is not required per IPC-J-STD-001
| https://www.eptac.com/faqs/ask-helena-leo/page/5
: Are there any specifications referencing Polyphenylene Sulfide (PPS) film capacitors and horizontal lifts on sides (or cracks) when heated like ceramic chips if cracked horizontal, or is it considered a defect for all three classes
