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SolderTips: Problems With Stress Cracks in Ceramic Components - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components/

. Although it may not be seen at this time, the ceramic will fracture when exposed to heat cycles. Solder paste, Tin/Lead or Lead-Free. Lead-Free is more brittle and the stress relief will be absorbed by the component causing it to crack

SolderTips: Problems With Stress Cracks in Ceramic Components - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components

. Although it may not be seen at this time, the ceramic will fracture when exposed to heat cycles. Solder paste, Tin/Lead or Lead-Free. Lead-Free is more brittle and the stress relief will be absorbed by the component causing it to crack

Application Notes

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes

  Plastic ICs/PEMs Flex Circuit Smart Card Bonded Wafers Chip Scale Package Flip Chip Hybrid Ceramic Solar Cells Packaging, Seals Materials Other   Plastic ICs/PEMs

ASYMTEK Products | Nordson Electronics Solutions

Microelectronics

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/sonoscan-applications/microelectronics

: PEM-INST-001 ESA/SCC Spec No.25200 Ceramic Chip Capacitors Discoidals, Filters, MLCCs, etc. Mil-PRF-123, 31033 & 49470 Die Attach Mil-STD-883

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3V VOIDS AND CRACKS

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2470-3v-voids-and-cracks

About Us Sonoscan Leadership Company History Locations Patent List News Events Careers Nordson SONOSCAN Home Support Application Notes 3V VOIDS AND CRACKS 3V VOIDS AND CRACKS Ceramic Cutting Tool

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Electronics - Assembly and Packaging

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/electronics-assembly-and-packaging?con=t&page=9

keeps the top surface dry. Frequency Domain Imaging (FDI)™ Nordson SONOSCAN PBGA POPCORN CRACK Nordson SONOSCAN PBGA Popcorn Crack - Application Note 245 PBGA 3D SECTIONED VOIDS Nordson SONOSCAN PBGA 3D Sectioned Voids in Molding Compound - Application Note

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Automotive and Transportation

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/automotive-and-transportation?con=t&page=8

& I Solution Center 22 Nordson DAGE ECHOES UP ECHOES DOWN. THE VERSATILITY OF AMI. Nordson SONOSCAN Time Domain Imaging (TDI)™ Nordson SONOSCAN PBGA POPCORN CRACK Nordson SONOSCAN PBGA Popcorn Crack - Application Note 245 PBGA 3D SECTIONED VOIDS Nordson SONOSCAN PBGA 3D Sectioned Voids in Molding Compound - Application Note 210 Waterplume™

ASYMTEK Products | Nordson Electronics Solutions

Test and Inspection

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/applications/test-and-inspection?con=t&page=8

: Test and Inspection IGBT Modules Interrogated Acoustically Nordson SONOSCAN POPCORN CRACK Nordson SONOSCAN Plastic Encapsulated Microcircuit (PEM

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