ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes
Delaminations 1148 PQFP Heat Damage 1086 SOIC Die and Lead Delamination 2250 SOJ Lead and Paddle Delaminations 2515 Plastic Encapsulated Microcircuit (PEM
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/automotive-and-transportation?con=t&page=11
Nordson SONOSCAN VOIDS THROUGH TRANSMISSION Nordson SONOSCAN Chip On Board Voids, Through Transmission - Application Note 1021 HEAT DAMAGE Nordson SONOSCAN PQFP Heat Damage - Application Note 1148
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/applications/test-and-inspection?con=t&page=11
Nordson SONOSCAN VOIDS THROUGH TRANSMISSION Nordson SONOSCAN Chip On Board Voids, Through Transmission - Application Note 1021 HEAT DAMAGE Nordson SONOSCAN PQFP Heat Damage - Application Note 1148
Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-moisture-sensitive-devices-msds/
. The increase in temperature has led to more damage, and more botched yields. According to Assembly Mag , for every 10-degree increase in temperature, the MSL rating degrades by one level
Surface Mount Technology Association (SMTA) | https://www.smta.org/LED/tech.cfm
., CALCE, University of Maryland 12:00 PM Lunch Session 3: LED Packaging 1:00 PM Solder Alloy Selection for LED Die Bonding and Package Assembly Nicholas Herrick, Alpha Assembly Solutions 1
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/publications
SHADOWS INDICATE CRACKS As Published in EPP Europe May/June 2007 Microelectronics - Chip Scale Package CHIP-SCALE PACKAGES: INSPECTION METHODS FOR DIVERSE DESIGNS As Published in Electronics Engineer Nov 1997 CSP AND MICRO-BGA PROCESS AND DAMAGE ASSESSMENT WITH ACOUSTIC MICRO IMAGING As Presented at SMTA September 2000
| http://etasmt.com/cc?ID=te_news_industry,26561&url=_print
The overall objective in DCA (Direct Chip Attach) is to apply ample force to coin the bumps to approximately the same height while at the same time ensuring that maximum bump height is obtained thus keeping the die surface away from the flux
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/advanced-technology-solutions/semiconductor
. By this approach, the IC packaging is then independent from the chip processing. However, such a process brings numerous mechanical loadings during molding and curing phases
| http://etasmt.com:9060/te_news_industry/2021-09-15/26561.chtml
The overall objective in DCA (Direct Chip Attach) is to apply ample force to coin the bumps to approximately the same height while at the same time ensuring that maximum bump height is obtained thus keeping the die surface away from the flux
| http://etasmt.com/te_news_industry/2021-09-15/26561.chtml
The overall objective in DCA (Direct Chip Attach) is to apply ample force to coin the bumps to approximately the same height while at the same time ensuring that maximum bump height is obtained thus keeping the die surface away from the flux
