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applications" In the Fan-Out, Wafer Level Packaging & Flip Chip segment of the conference Wednesday, March 16, 2016 4:00 p.m. - 4:30 p.m. (Full conference is March 15-17, 2016) Abstract http
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: IPC-7351B Concave and Rectangular End Cap (Chip) lead-forms each only have 2 options for Toe, Heel and Side solder joints, regardless of the Chip Array pin pitch range from 0.80 mm to
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