Surface Mount Technology Association (SMTA) | https://www.smta.org/store/book_store.cfm
Mitigating Tin Whisker Risks: Theory and Practice Takahiko Kato, Carol Handwerker, Jasbir Bath This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
. Abstract 32-2 The Study of Dissolution of Bi Precipitates in Sn Using a Novel In Situ Heating Technique in the SEM Peter Banh, André M. Delhaise, Doug D. Perovic Abstract 32-2 Tin Whisker Formation in Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage, Part I
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Robert Darveaux, Amkor Technology "Mechanical Testing of Solder Joint Arrays Versus Bulk Solder Specimens" 2005: Julia Y. Zhao, Analog Devices "A Study of the Failure Mechanisms in Lead-free and Eutectic Tin-lead Solder Bumps for Flip Chip Assembly" 2004
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, these solder paste will melt and then be forced out from under the sheet-type resistor-capacitor units, thus forming the tin sweats. It can be seen from its formation process that the higher the preheat temperature is and the faster the preheat speed is
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
°C above SnPb or SnAgCu solder liquidus temperatures. Four different sizes of pure tin plated chip resistors, 1206, 0805, 0603, and 0402 were used in this experiment
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
°C above SnPb or SnAgCu solder liquidus temperatures. Four different sizes of pure tin plated chip resistors, 1206, 0805, 0603, and 0402 were used in this experiment
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619
Surface Mount Technology Association (SMTA)
. Read Answer Maximum Limits of Solder Bath Contamination Question: If we are using a solder pot to tin wires and create solder joints (splices
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leave the soldering pad and some of them may hide under the chip components. When reflow soldering, these solder paste will melt and then be forced out from under the sheet-type resistor-capacitor units, thus forming the tin sweats. It can be seen from
