| http://etasmt.com/cc?ID=te_news_industry,26566&url=_print
>> SMT Technical Size Does Matter – Breaking the Barriers of Wafer Level Packaging Semiconductor packaging has traditionally followed dedicated equipment sets for given package formats or processes dictated by Bare Die or Flip Chip assembly
| http://www.szhonreal.com/uploadfile/Download/202305231105236644.pdf
| https://www.smtfactory.com/Development-Stage-of-SMT-Pick-and-Place-Machine-id47535177.html
. Although the mechanical alignment method used by the pick and place machine at that time determined the pick and place speed was low (1000~2000 pieces/hour), the pick and place
| http://etasmt.com:9060/te_news_industry/2021-09-15/26566.chtml
– Breaking the Barriers of Wafer Level Packaging From: Author:Mark Hardy Publish time:2021-09-15 14:13 Clicks:8 Semiconductor packaging has traditionally followed dedicated equipment sets for given package formats or processes dictated by Bare Die or Flip Chip assembly
| http://etasmt.com/te_news_industry/2021-09-15/26566.chtml
– Breaking the Barriers of Wafer Level Packaging From: Author:Mark Hardy Publish time:2021-09-15 14:13 Clicks:7 Semiconductor packaging has traditionally followed dedicated equipment sets for given package formats or processes dictated by Bare Die or Flip Chip assembly
GPD Global | https://www.gpd-global.com/co_website/pdf/dispense/XYZ-Calibration-Station.pdf
® is a leader in high p r e c i s i o n , high accuracy d i s p e n s i n g systems. Backlit Calibration Station This model of calibration station provides the highest level of camera-to-needle alignment
GPD Global | https://www.gpd-global.com/pdf/dispense/XYZ-Calibration-Station.pdf
® is a leader in high p r e c i s i o n , high accuracy d i s p e n s i n g systems. Backlit Calibration Station This model of calibration station provides the highest level of camera-to-needle alignment
| http://etasmt.com/cc?ID=te_news_bulletin,10761&url=_print
. Solder paste printing in the SMT process is critical to quality and efficiency! At present, the Chip parts selected for electronic products tend to be miniaturized and thinned, and the chip wiring pitch and the solder ball diameter are always reduced, which puts higher
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/collections/bga-rework-stations/products/bga-rework-machine-model-sv550
with Split-Vision Alignment for Removal, Placement, and Soldering of BGAs, CGA's, CSPs, QFPs, LGA's and Other SMDs. Comes with a standard resolution vision system capable of placing components from 6mm to 60mm on PCB's as large as 26 inches
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