Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/materials-available/
. Along with these attributes, it brings improved productivity with its fast cure system while using current fabrication techniques. Materials include: FR-4 Standard Multifunctional 130 Tg FR-4 High 170 Tg Getek 170 Tg NAN-YA NPG-R/NPG-TL ISOLA 410 Rogers Thermal Clad
ORION Industries | http://orionindustries.com/pdfs/X300-series.pdf
.) Class All Properties Polybutylene terephthalate (PBT) - clad aluminum, copper or tin-plated copper . EM-1305 NC Al 0.002 0.009 94V-2 50 EM-2305 NC Cu 0.002
| http://etasmt.com/cc?ID=te_news_industry,26961&url=_print
. And our epoxy resin and BT are all organic materials. 2. Inorganic materials: ① Aluminum substrate: The aluminum substrate is a metal-based copper clad laminate with good heat dissipation function
| http://etasmt.com/cc?ID=te_news_bulletin,24967&url=_print
PICk And Place Machinetabke Top Meachin , SMD PICk And Place Machine Juki Nozzal , Copper Clad Laminator PICk And Place Machine , SMD
ORION Industries | http://orionindustries.com/pdfs/X700-series.pdf
.) Class All Properties Polycarbonate (PC) - clad aluminum, copper or tin-plated copper . EM-1710 BK Al 0.002 0.014 94V-0 50 EM-2710 BK Cu 0.002
| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_IPCDesigner_CID.pdf
• Considerations for Design • Placement and Routing Techniques • Electrical Characteristics • Copper Clad Laminates • Holes in Printed Boards
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post9030.html
and Flexible Adhesive Bonding Films IPC-4204 - Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry IPC-4552 - Specification for Eletroless Nickel/Immersion Gold (ENIG
| https://www.eptac.com/etrainings/ipc-designer-certification-online/
: IPC Certificate of Training DAY 1 DESIGN CONSIDERATIONS Considerations for Design Placement and Routing Techniques Electrical Characteristics Copper Clad Laminates Holes in Printed Boards Drilling
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post7624.html
and Flexible Adhesive Bonding Films IPC-4204 - Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry IPC-4552 - Specification for Eletroless Nickel/Immersion Gold (ENIG
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipc-standards-for-manufacturing-assembly_topic877_post7624.html
and Flexible Adhesive Bonding Films IPC-4204 - Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry IPC-4552 - Specification for Eletroless Nickel/Immersion Gold (ENIG
