ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/syringe-barrels-and-cartridges?con=t&page=3
. Optimum Class VI Dispensing Components Nordson EFD Optimum® Class VI dispensing components are manufactured from biocompatible USP Class VI resin
| https://www.eptac.com/etrainings/category/600/
– Online Program This 3-day Instructor Level live online course, for certification, utilizes the images in the IPC-A-600 document to provide visual accept/reject criteria examples for all three... ( Learn more ) Next Class
| https://www.eptac.com/soldertip/soldertip-48-the-cleanliness-of-wire-and-terminal-connections/
: Through Hole Soldering of Thick PCBs SolderTip #38: Clean vs No-Clean Fluxes SolderTip #39: Class 2 vs Class 3 Assemblies SolderTip #40: Component Mounting and Acceptability Question
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/syringe-barrels-and-cartridges?nor_division_facet_a=38e6bb9923e04db7943358e513b9dc97&con=t&page=3
. Products Content Your results for: Syringe Barrels & Cartridges Optimum Class VI Dispensing Components Data Sheet Nordson EFD Enhanced biocompatibility for medical manufacturing. Nordson EFD’s Optimum®
| https://www.eptac.com/soldertip/acceptability-of-conformal-coating-bubbles/
#38: Clean vs No-Clean Fluxes SolderTip #39: Class 2 vs Class 3 Assemblies SolderTip #40: Component Mounting and Acceptability Question
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-services/engineering-and-consulting-services/
” Specialized Services Comprehensive Assessment Training Program Support Training Material Evaluation Course Development Workforce Development Engineering Services Class 3 Facility The Blackfox Process
| https://www.eptac.com/webinars/plated-through-hole-fill-understanding-the-process-and-assembly-requirements/
. Topics we will be reviewing are: Criteria for Hole Fill. Differences between Class 2 and Class 3 Requirements. New changes for thick boards in Class 2
| https://www.eptac.com/webinars/plated-through-hole-fill-understanding-the-process-and-assembly-requirements
. Topics we will be reviewing are: Criteria for Hole Fill. Differences between Class 2 and Class 3 Requirements. New changes for thick boards in Class 2
Blackfox Training Institute, LLC | https://www.blackfox.com/ipc-certification/ipc-specialist/ipc-77117721-cis-recertification/
proficiently to Class 3 standards, using a variety of methods. Perform conformal coating removal, laminate repair, pad and trace repair and place and route modification wires Successfully pass the written exam with a score of 70
| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_J-STD-CIT.pdf
. Students must pass written exams and soldering skills meeting Class 3 inspection to obtain certification. WHO SHOULD BECOME CERTIFIED This is an advanced course
winsouce.jpg)