| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
2.54 micrometers or 100 micro-inches (.00001”) and from all components which will be hand soldered, regardless of gold thickness. The double tinning process is for tinning the components prior to soldering them, and the need is to dip those components in the solder pot twice to remove the gold plating
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
. The way 001 is written, there is no exemption for surface mount components, 4.5.1b states Gold shall [N1P2D3] be removed: b. From 95% of all surface to be soldered of surface mount component regardless of gold thickness
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering
2.54 micrometers or 100 micro-inches (.00001”) and from all components which will be hand soldered, regardless of gold thickness. The double tinning process is for tinning the components prior to soldering them, and the need is to dip those components in the solder pot twice to remove the gold plating
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
) and Gold Embrittlement Conditions David Hillman and Daphne Gates Abstract 32-3 Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array (FCBGA
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=2
Black Blue Red GoldFingers * Gold Finger Plating Thickness No Gold Fingers 10u" 20u" 30u" 50u" Routing Individual Scoring Route/Retain Route/Retain/Scoring Cutouts/Slots
| https://www.eptac.com/soldertips/soldertips-solderability-issues-with-nickle-plated-surfaces/
. Recent Posts Solder Pot Maintenance and Dross Removal What’s with the expiration dates on solder paste or wire? Accept or Reject: Solder Contacting Component Bodies Issues of Burnt Flux on Class 3 PCB Assemblies Gold Removal Issues with Hollow Cup Connectors Acceptability of Conformal Coating Bubbles Search Looking for Training Products? SolderTraining.com can help
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_10_21_09.pdf
. Using shall creates another element needing to be monitored which is not necessary. 9/09 13 Highlights of 001 Changes Added requirements for soldering to lead-free components for class 3
