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. WS flux residue is corrosive and should be removed as soon as possible after reflow to avoid damage to your assembly. Maximum safe time before cleaning is product dependent
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0.0 CNY BALANCEABLE AIR IONIZER 220V ¥ 0.00 0.0 CNY DESSOLDER MESH 1.5X2.00 MM ¥ 0.00 0.0 CNY COPPER REFILL FOR CLEANING SOLDERING IRON TIPS ¥ 0.00
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/page/15?order=list_price+desc
0.0 CNY BALANCE 1-3KG ¥ 0.00 0.0 CNY BALANCEABLE AIR IONIZER 220V ¥ 0.00 0.0 CNY DESSOLDER MESH 1.5X2.00 MM ¥ 0.00 0.0 CNY COPPER REFILL FOR CLEANING SOLDERING IRON TIPS ¥ 0.00
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Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
) is a medium that connects electronic components in a controlled manner. It has a laminated sandwich structure such that each layer contains circuit traces and other features etched onto sheets of copper
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