| https://www.eptac.com/faqs/ask-helena-leo/ask/vapor-phase-soldering-to-immersion-tin-plated-pads
Vapor Phase Soldering to Immersion Tin Plated Pads - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-courses/operator/comprehensive-soldering/
Comprehensive Soldering Training Lead Free or Tin Lead Skip to content Phone: (888) 837-9959 | sharonm@blackfox.com Store | Home | EN ES Search for: Course Calendar Course Calendar 2023 IPC Certification Online IPC Training IPC Instructor Online IPC Training IPC A-610 CIT IPC A-610 CIT Recertification IPC J-STD-001 CIT IPC J-STD-001 CIT
Lewis & Clark | https://www.lewis-clark.com/product/cab-maestro-3e-450-tin-pcb-separator/
CAB Maestro 3E/450 TIN PCB Separator - Lewis and Clark, Inc. Skip to content My Cart: $ 0.00 0 View Cart Checkout No products in the cart. Subtotal
| https://www.eptac.com/faqs/ask-helena-leo/ask/wet-sponge-cleaning-vs-dry-brass-sponge-cleaning
Wet Sponge Cleaning vs. Dry Brass Sponge Cleaning - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
Lewis & Clark | https://www.lewis-clark.com/product-tag/cab-meastro-3e-450-tin-pcb-separator/
CAB Meastro 3E 450 TIN PCB Separator Archives - Lewis and Clark, Inc. Skip to content My Cart: $ 0.00 0 View Cart Checkout No products in the cart. Subtotal
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/technology-roadmap/
• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control
Imagineering, Inc. | https://www.pcbnet.com/quote/assembly-quote/?cpn=0
) Immersion Tin Immersion Silver HASL (Leaded) LF HASL OSP Minimum Trace/Space 0.005" 0.006" 0.007" 0.008" Testing No Yes SMD Side None Top Side Bottom Side Both Sides SMD Pitch N/A 0.015" 0.020" 0.025" over
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-china/
* Materials FR4(130Tg) FR4(170Tg) FR406(180Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating ENIG1U" (Immersion Gold) ENIG2U" (Immersion Gold) ENIG3U" (Immersion Gold) ENIG4U" (Immersion Gold) ENIG5U" (Immersion Gold) Immersion Tin Immersion Silver HASL
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-taiwan/
* Materials FR4(130Tg) FR4(170Tg) FR406(180Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating ENIG1U" (Immersion Gold) ENIG2U" (Immersion Gold) ENIG3U" (Immersion Gold) ENIG4U" (Immersion Gold) ENIG5U" (Immersion Gold) Immersion Tin Immersion Silver HASL
