| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-selection-for-printed-circuit-boards-and-terminals
? My second question is what kind of solder would you suggest for doing repair or adding a component to a surface mount board? Answer: The type of flux to be used is determined by the surfaces being soldered, such as HASL, OSP, ENIG, Gold, Pd, etc
| https://www.eptac.com/ask/solder-selection-for-printed-circuit-boards-and-terminals/
? My second question is what kind of solder would you suggest for doing repair or adding a component to a surface mount board? Answer: The type of flux to be used is determined by the surfaces being soldered, such as HASL, OSP, ENIG, Gold, Pd, etc
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
experiments in this study were performed on an OSP finished board. Finishes such as OSP which do not have a nickel later represent the worst case scenario with respect to Cu dissolution. An OEM server product was used as the test vehicle throughout this study
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. Hard gold is durable and RoHS compliant but also expensive. Organic solderability preservative (OSP) is RoHS-compliant and cost-effective but has a short shelf life
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
Events Event Calendar Call for Participation Conferences & Symposia SMTA International Additive Electronics China Conferences Counterfeit Symposium Electronics in Harsh Environments Cleaning
Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/
Events Event Calendar Call for Participation Conferences & Symposia SMTA International Additive Electronics China Conferences Counterfeit Symposium Electronics in Harsh Environments Cleaning
| http://www.thebranfordgroup.com/dnn3/Auction/TSLE0523.aspx
. Sn - Osp manual electroplating w/post-cleaning + dryer Laif Cu & Tn Pattern Plate Electroplating Line PVA Tepla Plasma-Etch System Hot Air Levelling Laif HASL Pre-Clean Line Cemco Quicksilver Hot Air Leveller lead free Pola e Massa HASL post-cleaning Artwork
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
, 1.0mm pitch, various solder ball diameters SnPb solder paste Test vehicle one: 2.36mm thick (93 mil), FR-4, 8 internal planes, OSP finish Thermal cycling: 0°C-100
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
, 1.0mm pitch, various solder ball diameters SnPb solder paste Test vehicle one: 2.36mm thick (93 mil), FR-4, 8 internal planes, OSP finish Thermal cycling: 0°C-100
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