ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
. Residue may be removed with an appropriate solvent. Water Soluble (WS) Water soluble flux consists of activators, thixotrope, and solvent
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide
. Residue may be removed with an appropriate solvent. Water Soluble (WS) Water soluble flux consists of activators, thixotrope, and solvent
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/underfilling?con=t&page=38
Pelletizers, Melt Filtration Systems, Gear Pumps, and Valves Ficha de Datos de Seguridad - Paste Flux Water Soluble (MX EN) Nordson EFD Paste Flux, FluxPlus, WS OPS Biax Film Dies Polymer Processing Systems Custom-designed EDI®
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
centipoises (kcPs). Voids Cavities inside a solder joint containing liquids and gases trapped during reflow. W Water Soluble Paste (WS) A mixture of organic acids, thixotrope, and solvent. WS flux comes in a wide range of activity levels for soldering to
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
centipoises (kcPs). Voids Cavities inside a solder joint containing liquids and gases trapped during reflow. W Water Soluble Paste (WS) A mixture of organic acids, thixotrope, and solvent. WS flux comes in a wide range of activity levels for soldering to
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
factors that leads to water film formation on PCBA under humid conditions and show how these factors on the other hand can be used as a means to minimize humidity interaction with PCBA. Aim is to show the possibility of enhancing intrinsic humidity
Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/
factors that leads to water film formation on PCBA under humid conditions and show how these factors on the other hand can be used as a means to minimize humidity interaction with PCBA. Aim is to show the possibility of enhancing intrinsic humidity
Surface Mount Technology Association (SMTA) | https://www.smta.org/news/smta_calendar/calendar.cfm
factors and their relation to the sequential failure development under humid conditions and how to avoid them. This webinar will focus on the factors that leads to water film formation on PCBA under humid conditions and show how these factors on the other
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
. Without a nitrogen blanket one can expect heavier oxidation of the surfaces to be soldered. In addition, the no-clean fluxes are not as active as the water soluble fluxes, therefore reducing the oxides is more difficult
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