Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. An opposing school of thought was that voids act as crack arrestors, which improve solder joint life. The root cause of voids in BGA solder joints is well understood by the electronics industry with a number of papers published on the topic [1, 2, 3]. R
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Heller Industries Inc. | https://hellerindustries.com/bit_publications/the-last-will-and-testament-of-the-bga-void/
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Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
phases in the Pb-free microstructure. RESULTS Solder Joint Void Characterization The factory x-ray inspection on the conventional or standard SMT (STD SMT) reflow assembly revealed substantial void content in the BGA solder joints of both components. The x
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PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/bga-pad-size_topic2607_post10645.html
0.26mm nominal ball diameter or a 0.33mm nominal ball diameter. Would it be OK to set the Max- Min to a single value like 0.06mm for collapsing BGA balls of 0.30mm to
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/bga-pad-size_topic2607_post12477.html
. Non-collapsing BGA's have larger pads to accommodate via-in-pad and establish an adequate annular ring. The BGA ball does not collapse around the edge of the pad like a collapsing ball does
