PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic1383&OB=DESC.html
0.10 mm Updated Periphery Solder Joint Goals for DFN component less than 1.6 mm in length per upcoming IPC-7351C Periphery Goal for these micro-miniature bottom only terminal packages is now set to
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1383&OB=ASC.html
0.10 mm Updated Periphery Solder Joint Goals for DFN component less than 1.6 mm in length per upcoming IPC-7351C Periphery Goal for these micro-miniature bottom only terminal packages is now set to
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1383&OB=DESC.html
0.10 mm Updated Periphery Solder Joint Goals for DFN component less than 1.6 mm in length per upcoming IPC-7351C Periphery Goal for these micro-miniature bottom only terminal packages is now set to
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/library-expert-2014-06-released_topic1383_post5526.html
0.10 mm Updated Periphery Solder Joint Goals for DFN component less than 1.6 mm in length per upcoming IPC-7351C Periphery Goal for these micro-miniature bottom only terminal packages is now set to
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/peel-testing?con=t&page=10
Application Cold Bump Pull Nordson DAGE Nordson DAGE bondtesters provide cold bump pull tests to vertically remove the solder ball from a device or substrate by using patented tweezer jaws
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/zone-shear?con=t&page=5
) to apply an impact load to the solder ball so that the load is transferred down to the under bump material. High strain rate… Cold bump pull Nordson DAGE Nordson DAGE bondtesters provide cold bump pull tests to vertically remove the solder ball from a device or substrate by using patented tweezer jaws
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/software?con=t&page=12
(1) Textile (1) Test Types Ball Shear Solder Ball Shear (1) Bump Shear (1) Cavity Shear (1) Cold Bump Pull (1) Die Shear (1) Fatigue Push-Pull (1) First Bond Ball Pull Stud Bump Pull
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/bump-shear?con=t
. Cold Bump Pull Nordson DAGE Nordson DAGE bondtesters provide cold bump pull tests to vertically remove the solder ball from a device or substrate by using patented tweezer jaws
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/bondtesters?con=t&page=5
. Semiconductor Nordson DAGE Cold bump pull Nordson DAGE Nordson DAGE bondtesters provide cold bump pull tests to vertically remove the solder ball from a device or substrate by using patented tweezer jaws
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/medical-life-science-and-pharmaceutical?con=t&page=31
provide cavity shear testing as an alternative method for applying a load to a solder ball or ball bond in shear. Technical Papers - Materials Testing Nordson DAGE Nordson DAGE Announces Further Orders for its Unique Patented Hot Pin Pull Test Method on the 4000Plus Bondtester Nordson DAGE The only system that
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
.gif)
